Global Test & Burn-in Socket Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Global Test & Burn-in Socket Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Test & Burn-in Socket market size was valued at US$ 1486 million in 2024 and is forecast to a readjusted size of USD 2492 million by 2031 with a CAGR of 7.0% during review period.

There are two important tests in semiconductor manufacturing. One is the wafer test during the wafer process, in which electrical characteristics of chips are tested before dicing a wafer into many pieces of semiconductor (called dies or chips). The other is the final test during the assembly and testing process, which is conducted after packaging the diced chips. An IC socket is used in the final test. It plays the crucial role of connecting the device and the tester, just as a probe card does in the wafer test (see the figure below). Depending on the purpose of the test, IC sockets are categorized into two groups: burn-in sockets for testing reliability, including durability, and test sockets for measuring electrical characteristics. Although these two types are both generally referred to as IC sockets, the required performance varies depending on the difference in use.

Global key players of Test & Burn-in Socket include Enplas, Cohu, Yamaichi Electronics, Smiths Interconnect, ISC, etc. The top five players hold a share about 41%. North America is the largest market for Test & Burn-in Socket, which has a share about 27%, followed by Japan and South Korea with share 24% and 17%, separately. In terms of product type, Test Socket is the largest segment, occupied for a share of 63%. In terms of application, SOC, CPU, GPU, etc. has a share about 32%.

2021 is a year of great development of the semiconductor industry, due to the unpredictable international situation, repeated epidemics, home economy, online education and training, automotive electronics ushered in comprehensive growth, resulting in continued increase in chip demand. The global COVID-19 pandemic is positively driving demand for the semiconductor industry. Semiconductor manufacturers develop more technologically advanced chips to meet the demands of digitalization. In addition, more and more products are being built with more semiconductors. These results have also led to strong growth in demand for inspection equipment needed to manufacture semiconductors. This in turn promotes the growth of the test aging socket market.

The global semiconductor market turnover declined 8.2% in 2023 to reach $526.9 billion, but is expected to grow 16% in 2024 to reach $611.2 billion, a record high. This growth is mainly due to the completion of supply chain inventory destocking and the booming development of generative AI. In 2024, the AI chip market size is expected to increase by 33% to reach $71.3 billion, further driving the growth of the semiconductor IC market.

Memory market: After a sharp decline in 2023, it is expected to rebound strongly in 2024, and the market turnover will reach $163.153 billion, a significant growth of 76.8% from 2023. Logic IC market: Relatively stable, projected to grow 10.7% in 2024, rising to $196.76 billion. Power semiconductor market: Stable and good, it is expected that the global power semiconductor market will reach $50.3 billion in 2023. As the world's largest consumer of power semiconductors, China's market size is expected to reach $21.2 billion.

Domestic substitution: With the reshaping of the global semiconductor supply chain, the localization process of China's semiconductor industry is accelerating. Domestic enterprises have made breakthroughs in the fields of silicon carbide substrate and 12-inch chemical mechanical polishing equipment. Core equipment breakthrough: Domestic semiconductor equipment and core components have developed rapidly, and continue to catch up and break through in the subdivisions of vacuum valves, ultra-precision motion platforms, and wafer transmission.

This report is a detailed and comprehensive analysis for global Test & Burn-in Socket market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Test & Burn-in Socket market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Test & Burn-in Socket market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Test & Burn-in Socket market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2020-2031

Global Test & Burn-in Socket market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Test & Burn-in Socket

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Test & Burn-in Socket market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech, Yokowo, WinWay Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Test & Burn-in Socket market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Burn-in Socket
Test Socket

Market segment by Application
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other Non-Memory

Major players covered
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics（Smiths）
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
MJC
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts
TwinSolution

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Test & Burn-in Socket product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Test & Burn-in Socket, with price, sales quantity, revenue, and global market share of Test & Burn-in Socket from 2020 to 2025.

Chapter 3, the Test & Burn-in Socket competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Test & Burn-in Socket breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Test & Burn-in Socket market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Test & Burn-in Socket.

Chapter 14 and 15, to describe Test & Burn-in Socket sales channel, distributors, customers, research findings and conclusion.