Global Temporary Bonding Adhesive Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Temporary Bonding Adhesive market size was valued at US$ 220 million in 2024 and is forecast to a readjusted size of USD 374 million by 2031 with a CAGR of 8.0% during review period.

Temporary bonding adhesives are specialized adhesives designed to provide a temporary bond between two surfaces, allowing them to be separated later without leaving residue or causing damage. These adhesives are often used in the electronics and semiconductor industries, particularly in processes such as wafer thinning, handling, and packaging. They provide reliable adhesion during critical manufacturing steps and are removed using heat, UV light, or chemical solutions.

Global key players of temporary bonding adhesive include 3M, Daxin Materials, etc. Global top 3 companies hold a share over 40%. Asia Pacific is the largest market, with a share over 70%, followed by Europe and North America with the share about 15% and 10%.

The temporary bonding adhesive market has been gaining momentum, largely due to the growing demand in advanced industries like semiconductors, electronics, and automotive manufacturing. These adhesives are crucial in processes like wafer thinning, chip packaging, and assembly, especially as electronic devices become smaller and more complex. The miniaturization of electronics has driven the need for adhesives that provide reliable yet removable bonds during production. This has led to an increasing focus on high-performance temporary bonding solutions that can handle complex manufacturing processes while enabling efficient debonding without damaging delicate components.

Technological advancements are shaping the temporary bonding adhesive market as manufacturers develop more specialized formulations to meet the stringent requirements of modern industries. For example, in semiconductor manufacturing, temporary adhesives need to withstand extreme conditions such as high temperatures and chemical exposure during processing but must also be easily removed afterward. Innovations in materials, such as UV-curable and heat-resistant adhesives, are helping to expand the application scope of temporary bonding in various industries, enabling faster and more efficient production processes.

The market is also being influenced by sustainability and cost-efficiency trends. Manufacturers are focusing on creating adhesives that are not only effective but also environmentally friendly, aiming to reduce the environmental impact of temporary bonding processes. Recyclable materials and adhesives that can be removed with less energy-intensive methods are gaining attention. However, challenges such as the high cost of specialized adhesives and the need for precise application techniques may limit adoption in cost-sensitive markets. Despite these challenges, the temporary bonding adhesive market is expected to grow steadily, driven by the increasing complexity of modern manufacturing and the need for high-precision, temporary bonding solutions.

This report is a detailed and comprehensive analysis for global Temporary Bonding Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Debonding Method and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Temporary Bonding Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Ton), and average selling prices (US$/Kg), 2020-2031

Global Temporary Bonding Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Ton), and average selling prices (US$/Kg), 2020-2031

Global Temporary Bonding Adhesive market size and forecasts, by Debonding Method and by Application, in consumption value ($ Million), sales quantity (Ton), and average selling prices (US$/Kg), 2020-2031

Global Temporary Bonding Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Ton), and ASP (US$/Kg), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Temporary Bonding Adhesive

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Temporary Bonding Adhesive market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include 3M, Daxin Materials, Brewer Science, AI Technology, YINCAE Advanced Materials, Micro Materials, Promerus, Daetec, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Temporary Bonding Adhesive market is split by Debonding Method and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Debonding Method, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Debonding Method
Thermal Slide－off Debonding
Mechanical Debonding
Laser Debonding

Market segment by Application
MEMS
Advanced Packaging
CMOS
Others

Major players covered
3M
Daxin Materials
Brewer Science
AI Technology
YINCAE Advanced Materials
Micro Materials
Promerus
Daetec

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Temporary Bonding Adhesive product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Temporary Bonding Adhesive, with price, sales quantity, revenue, and global market share of Temporary Bonding Adhesive from 2020 to 2025.

Chapter 3, the Temporary Bonding Adhesive competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Temporary Bonding Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Debonding Method and by Application, with sales market share and growth rate by Debonding Method, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Temporary Bonding Adhesive market forecast, by regions, by Debonding Method, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Temporary Bonding Adhesive.

Chapter 14 and 15, to describe Temporary Bonding Adhesive sales channel, distributors, customers, research findings and conclusion.