Global System In a Package (SIP) and 3D Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global System In a Package (SIP) and 3D Packaging Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

A System in a Package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked using package on package. The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone, digital music player, etc. Dies containing integrated circuits may be stacked vertically on a substrate. They are internally connected by fine wires that are bonded to the package. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. A SiP is like a system on a chip (SoC) but less tightly integrated and not on a single semiconductor die.

SiP dies can be stacked vertically or tiled horizontally, unlike less dense multi-chip modules, which place dies horizontally on a carrier. SiP connects the dies with standard off-chip wire bonds or solder bumps, unlike slightly denser three-dimensional integrated circuits which connect stacked silicon dies with conductors running through the die.

The System in a Package (SIP) and 3D Packaging industry can be broken down into several segments, non 3D Packaging, 3D Packaging, etc.

According to our (Global Info Research) latest study, the global System In a Package (SIP) and 3D Packaging market size was valued at US$ 10290 million in 2023 and is forecast to a readjusted size of USD 28460 million by 2030 with a CAGR of 15.8% during review period.

The top four global manufacturers of system-level packaging are Amkor, Spil, JCET and ASE, with a combined market share of 57 percent. According to the research study, the Non-3D Packaging type market held a significant share of the of the System in a Package (SIP) and 3D Packaging market. In 2019, the Non-3D Packaging type market accounting for 83% of the global System in a Package (SIP) and 3D Packaging market.

Based on application, the Consumer Electronics segment accounted for significant market share in 2019. Consumer Electronics segment is anticipated to continue to dominate the market during the forecast period.

Asia-Pacific held a key market revenue share of the System in a Package (SIP) and 3D Packaging market in 2019 which account for 59%. The increasing adoption of System in a Package (SIP) and 3D Packaging is expected to offer lucrative opportunities for vendors. In 2019, Amkor, SPIL, JCET ranked top 3 of the revenue share in global market. Leading companies will witness a stable growth in the following five years.

This report is a detailed and comprehensive analysis for global System In a Package (SIP) and 3D Packaging market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global System In a Package (SIP) and 3D Packaging market size and forecasts, in consumption value ($ Million), sales quantity (M Pieces), and average selling prices (USD/K Pieces), 2019-2030

Global System In a Package (SIP) and 3D Packaging market size and forecasts by region and country, in consumption value ($ Million), sales quantity (M Pieces), and average selling prices (USD/K Pieces), 2019-2030

Global System In a Package (SIP) and 3D Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (M Pieces), and average selling prices (USD/K Pieces), 2019-2030

Global System In a Package (SIP) and 3D Packaging market shares of main players, shipments in revenue ($ Million), sales quantity (M Pieces), and ASP (USD/K Pieces), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for System In a Package (SIP) and 3D Packaging

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global System In a Package (SIP) and 3D Packaging market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Amkor, SPIL, JCET, ASE, Powertech Technology Inc, TFME, ams AG, UTAC, Huatian, Nepes, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

System In a Package (SIP) and 3D Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Non 3D Packaging
3D Packaging

Market segment by Application
Telecommunications
Automotive
Medical Devices
Consumer Electronics
Other

Major players covered
Amkor
SPIL
JCET
ASE
Powertech Technology Inc
TFME
ams AG
UTAC
Huatian
Nepes
Chipmos
Suzhou Jingfang Semiconductor Technology Co

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe System In a Package (SIP) and 3D Packaging product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of System In a Package (SIP) and 3D Packaging, with price, sales quantity, revenue, and global market share of System In a Package (SIP) and 3D Packaging from 2019 to 2024.

Chapter 3, the System In a Package (SIP) and 3D Packaging competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the System In a Package (SIP) and 3D Packaging breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and System In a Package (SIP) and 3D Packaging market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of System In a Package (SIP) and 3D Packaging.

Chapter 14 and 15, to describe System In a Package (SIP) and 3D Packaging sales channel, distributors, customers, research findings and conclusion.