Global Solder Ball Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Solder Ball market size was valued at US$ 278 million in 2024 and is forecast to a readjusted size of USD 425 million by 2031 with a CAGR of 6.3% during review period.

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux.

Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

The Solder Ball industry can be broken down into several segments, Lead Solder Ball and Lead Free Solder Ball.

Across the world, the major players cover Senju Metal, DS HiMetal, etc.

Asia Pacific held the leading share of the market in terms of revenue. We estimate that the global market share of Solder Ball is 27% in Taiwan, 20% in Korea, 17% in Japan, 15% in China and 10% in South East Asia.

Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market. Senju Metal dominated with 40% revenue share, followed by DS HiMetal with 19% revenue share and MKE with 7% revenue share.

This report is a detailed and comprehensive analysis for global Solder Ball market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Solder Ball market size and forecasts, in consumption value ($ Million), sales quantity (M Units), and average selling prices (USD/M Units), 2020-2031

Global Solder Ball market size and forecasts by region and country, in consumption value ($ Million), sales quantity (M Units), and average selling prices (USD/M Units), 2020-2031

Global Solder Ball market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (M Units), and average selling prices (USD/M Units), 2020-2031

Global Solder Ball market shares of main players, shipments in revenue ($ Million), sales quantity (M Units), and ASP (USD/M Units), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Solder Ball

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Solder Ball market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Senju Metal, Accurus, DS HiMetal, NMC, MKE, PMTC, Indium Corporation, YCTC, Shenmao Technology, Shanghai hiking solder material, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Solder Ball market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Lead Solder Ball
Lead Free Solder Ball

Market segment by Application
BGA
CSP & WLCSP
Flip-Chip & Others

Major players covered
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Solder Ball product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Solder Ball, with price, sales quantity, revenue, and global market share of Solder Ball from 2020 to 2025.

Chapter 3, the Solder Ball competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Solder Ball breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Solder Ball market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Solder Ball.

Chapter 14 and 15, to describe Solder Ball sales channel, distributors, customers, research findings and conclusion.