Global Silicon Wafer Laser Dicing Machine Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Silicon Wafer Laser Dicing Machine Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Wafer fabs continually face challenges in manufacturing semiconductor devices because the devices continue to get tinier and more complicated. Integrated circuits continue to increase in circuit density. Trends in chip design and materials, such as using die attach films and wafers as thin as 50 μm, add to the complexity of manufacturing. In fabrication processes, wafer dicing plays an early and critical role in the quality of the final product.

For silicon wafers less than 100 μm thick, laser ablation offers an alternative to the blade technique, which is too powerful for the delicate thin wafers. However, laser ablation has its own problems. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. The debris deposited on the surface of the wafer is difficult to clean up, and the cracks result in chips with lower strength.

In contrast, stealth dicing does not generate the problems brought on by either the blade or laser ablation techniques. With stealth dicing, there is no chipping or debris, which eliminates the need for a cleanup process. It also reduces the amount of wasted wafer because of its very narrow dicing path, offering space on the wafer for more chips and higher production yield. Also, the technique does not cause heat damage because the laser cuts below the surface of the wafer; this contributes to rendering the chips more resistant to breakage.

According to our (Global Info Research) latest study, the global Silicon Wafer Laser Dicing Machine market size was valued at US$ 276 million in 2023 and is forecast to a readjusted size of USD 373 million by 2030 with a CAGR of 4.4% during review period.

This report is a detailed and comprehensive analysis for global Silicon Wafer Laser Dicing Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Silicon Wafer Laser Dicing Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global Silicon Wafer Laser Dicing Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global Silicon Wafer Laser Dicing Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global Silicon Wafer Laser Dicing Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Silicon Wafer Laser Dicing Machine

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Silicon Wafer Laser Dicing Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Han's Laser Technology, Wuhan Huagong Laser Engineering, Suzhou Delphi Laser, Tokyo Seimitsu, Suzhou Maxwell Technologies, Suzhou Quick Laser Technology, EO Technics, Synova S.A., Shenzhen Guangyuan Intelligent Equipment, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Silicon Wafer Laser Dicing Machine market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Traditional Dicing
Stealth Dicing

Market segment by Application
IDMs
OSATs

Major players covered
DISCO Corporation
Han's Laser Technology
Wuhan Huagong Laser Engineering
Suzhou Delphi Laser
Tokyo Seimitsu
Suzhou Maxwell Technologies
Suzhou Quick Laser Technology
EO Technics
Synova S.A.
Shenzhen Guangyuan Intelligent Equipment
China Electronics Technology Group
3D-Micromac AG
Genesem
ASMPT
GIE
Suzhou Lumi Laser Technology
Corning

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Silicon Wafer Laser Dicing Machine product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Silicon Wafer Laser Dicing Machine, with price, sales quantity, revenue, and global market share of Silicon Wafer Laser Dicing Machine from 2019 to 2024.

Chapter 3, the Silicon Wafer Laser Dicing Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Silicon Wafer Laser Dicing Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Silicon Wafer Laser Dicing Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Silicon Wafer Laser Dicing Machine.

Chapter 14 and 15, to describe Silicon Wafer Laser Dicing Machine sales channel, distributors, customers, research findings and conclusion.