Global SiN AMB Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global SiN AMB Substrate Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

According to our (Global Info Research) latest study, the global SiN AMB Substrate market size was valued at US$ 219 million in 2023 and is forecast to a readjusted size of USD 2271 million by 2030 with a CAGR of 40.1% during review period.

Global key players of SiN AMB Substrate include Rogers Corporation, Denka, Ferrotec, etc. Global top 3 companies hold a share over 75%. Japan is the largest producer, has a share about 42%, followed by Europe and China, with share 32% and 22%, respectively. Asia Pacific is the largest market, with a share about 64%, followed by Europe and Americas with the share about 29% and 6%.

This report is a detailed and comprehensive analysis for global SiN AMB Substrate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Substrate Thicknesses and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global SiN AMB Substrate market size and forecasts, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2019-2030

Global SiN AMB Substrate market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2019-2030

Global SiN AMB Substrate market size and forecasts, by Substrate Thicknesses and by Application, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Square Meter), 2019-2030

Global SiN AMB Substrate market shares of main players, shipments in revenue ($ Million), sales quantity (Square Meters), and ASP (US$/Square Meter), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for SiN AMB Substrate

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global SiN AMB Substrate market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers Corporation, Heraeus Electronics, Kyocera, Toshiba Materials, Denka, KCC, AMOTECH, Ferrotec, BYD, Shenzhen Xinzhou Electronic Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

SiN AMB Substrate market is split by Substrate Thicknesses and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Substrate Thicknesses, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Substrate Thicknesses
0.32mm SiN AMB Substrates
0.25mm SiN AMB Substrates

Market segment by Application
Automobile
Traction & Railway
New Energy & Power Grid
Military & Aerospace
Others

Major players covered
Rogers Corporation
Heraeus Electronics
Kyocera
Toshiba Materials
Denka
KCC
AMOTECH
Ferrotec
BYD
Shenzhen Xinzhou Electronic Technology
Zhejiang TC Ceramic Electronic
Shengda Tech
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe SiN AMB Substrate product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of SiN AMB Substrate, with price, sales quantity, revenue, and global market share of SiN AMB Substrate from 2019 to 2024.

Chapter 3, the SiN AMB Substrate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the SiN AMB Substrate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Substrate Thicknesses and by Application, with sales market share and growth rate by Substrate Thicknesses, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and SiN AMB Substrate market forecast, by regions, by Substrate Thicknesses, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of SiN AMB Substrate.

Chapter 14 and 15, to describe SiN AMB Substrate sales channel, distributors, customers, research findings and conclusion.