Global SiC Wafer Thinning Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global SiC Wafer Thinning Equipment market size was valued at US$ 100 million in 2024 and is forecast to a readjusted size of USD 295 million by 2031 with a CAGR of 16.7% during review period.

Global key players of SiC Wafer Thinning Equipment include Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto, etc. The top five players hold a share about 82%. China is the largest market for SiC Wafer Thinning Equipment and has a share about 36%, followed by North America and Japan, with share 32% and 12%, separately. In terms of product type, Full-Automatic is the largest segment, occupied for a share of 77%. In terms of application, 6 inches and Below is the largest application, occupied for a share of 72%.

This report is a detailed and comprehensive analysis for global SiC Wafer Thinning Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global SiC Wafer Thinning Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global SiC Wafer Thinning Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global SiC Wafer Thinning Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global SiC Wafer Thinning Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for SiC Wafer Thinning Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global SiC Wafer Thinning Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Disco, TSD, TOKYO SEIMITSU, Engis Corporation, Okamoto Semiconductor Equipment Division, Revasum, Koyo Machinery, G&N, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

SiC Wafer Thinning Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Full-Automatic
Semi-Automatic

Market segment by Application
6 inches and Below
6 Inch and Above

Major players covered
Disco
TSD
TOKYO SEIMITSU
Engis Corporation
Okamoto Semiconductor Equipment Division
Revasum
Koyo Machinery
G&N

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe SiC Wafer Thinning Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of SiC Wafer Thinning Equipment, with price, sales quantity, revenue, and global market share of SiC Wafer Thinning Equipment from 2020 to 2025.

Chapter 3, the SiC Wafer Thinning Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the SiC Wafer Thinning Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and SiC Wafer Thinning Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of SiC Wafer Thinning Equipment.

Chapter 14 and 15, to describe SiC Wafer Thinning Equipment sales channel, distributors, customers, research findings and conclusion.