Global SiC Wafer Laser Cutting Equipment Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Global SiC Wafer Laser Cutting Equipment Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global SiC Wafer Laser Cutting Equipment market size was valued at USD 94 million in 2022 and is forecast to a readjusted size of USD 257.8 million by 2029 with a CAGR of 15.6% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.

Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.

This report is a detailed and comprehensive analysis for global SiC Wafer Laser Cutting Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:

Global SiC Wafer Laser Cutting Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2018-2029

Global SiC Wafer Laser Cutting Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2018-2029

Global SiC Wafer Laser Cutting Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2018-2029

Global SiC Wafer Laser Cutting Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2018-2023

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for SiC Wafer Laser Cutting Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global SiC Wafer Laser Cutting Equipment market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Suzhou Delphi Laser Co, Han's Laser Technology, 3D-Micromac and Synova S.A., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market Segmentation

SiC Wafer Laser Cutting Equipment market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Processing Sizes up to 6 Inches
Processing Sizes up to 8 Inches

Market segment by Application
Foundry
IDM

Major players covered
DISCO Corporation
Suzhou Delphi Laser Co
Han's Laser Technology
3D-Micromac
Synova S.A.
HGTECH
ASMPT
GHN.GIE
Wuhan DR Laser Technology

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe SiC Wafer Laser Cutting Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of SiC Wafer Laser Cutting Equipment, with price, sales, revenue and global market share of SiC Wafer Laser Cutting Equipment from 2018 to 2023.

Chapter 3, the SiC Wafer Laser Cutting Equipment competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the SiC Wafer Laser Cutting Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and SiC Wafer Laser Cutting Equipment market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.

Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.

Chapter 13, the key raw materials and key suppliers, and industry chain of SiC Wafer Laser Cutting Equipment.

Chapter 14 and 15, to describe SiC Wafer Laser Cutting Equipment sales channel, distributors, customers, research findings and conclusion.