Global Semiconductor Wafer Tape Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Global Semiconductor Wafer Tape Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global Semiconductor Wafer Tape market size was valued at USD 1254.1 million in 2022 and is forecast to a readjusted size of USD 1842.1 million by 2029 with a CAGR of 5.6% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

The key manufacturers of Semiconductor Wafer Tape in the world are Mitsui Chemicals, LINTEC, Denka, Nitto, 3M, The Furukawa Electric, Sekisui Chemical, Resonac Corporation, and Sumitomo Bakelite Company, among which the top three manufacturers have a market share of over 50%. Currently, the largest manufacturer is Mitsui Chemicals. The production of semiconductor wafer tape worldwide is mainly concentrated in regions such as North America, Europe, and China, with the top three production regions accounting for over 90% of the market share, with North America being the largest production region. In terms of its product category, the growth rate of dicing tape is relatively high, and the market share is the highest, exceeding 60%, followed by back grinding tape and mold release tape. In terms of its application, wafer cutting is the largest application field, with a market share of nearly 60%, followed by wafer grinding and cleaning, packaging and masking, and acid etching.

Semiconductor wafer adhesive tape, also known as wafer scribing adhesive tape or simply referred to as wafer scribing adhesive tape, is a special adhesive tape used in the semiconductor industry to fix fine silicon wafers in place during the scribing process. One side of the adhesive tape has a strong adhesive that firmly adheres to the surface of the wafer, while the other side is typically made of a polymer film that provides support and stability during the scribing process. In semiconductor manufacturing, silicon wafers are typically divided into individual microchips through a process called scribing. The wafer is first coated with a photoresist, and then exposed to ultraviolet light through a photomask to form a circuit pattern on the wafer. The exposed area of the photoresist is then chemically etched away, leaving a circuit pattern on the wafer surface. A dedicated saw is then used to cut the wafer along these patterns into individual microchips. Semiconductor wafer tape is used to hold the wafers together during the scribing process to prevent them from cracking or breaking. After scribing is complete, remove the tape, and clean and package the individual microchips for use in electronic devices.

This report is a detailed and comprehensive analysis for global Semiconductor Wafer Tape market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:

Global Semiconductor Wafer Tape market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2018-2029

Global Semiconductor Wafer Tape market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2018-2029

Global Semiconductor Wafer Tape market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2018-2029

Global Semiconductor Wafer Tape market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2018-2023

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Wafer Tape

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Wafer Tape market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Chemicals, LINTEC, Denka, Nitto and 3M, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market Segmentation

Semiconductor Wafer Tape market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Back Grinding Tape
Mold Release Tape
Dicing Tape

Market segment by Application
Wafer Grinding and Cleaning
Wafer Cutting
Packaging and Masking
Acid Etching

Major players covered
Mitsui Chemicals
LINTEC
Denka
Nitto
3M
The Furukawa Electric
Sekisui Chemical
Resonac Corporation
Sumitomo Bakelite Company
Maxell Sliontec
Plusco Tech
KGK Chemical Corporation

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Wafer Tape product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Wafer Tape, with price, sales, revenue and global market share of Semiconductor Wafer Tape from 2018 to 2023.

Chapter 3, the Semiconductor Wafer Tape competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Wafer Tape breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Semiconductor Wafer Tape market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.

Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Wafer Tape.

Chapter 14 and 15, to describe Semiconductor Wafer Tape sales channel, distributors, customers, research findings and conclusion.