According to our (Global Info Research) latest study, the global Semiconductor Wafer Defect Inspection Equipment market size was valued at US$ 7724 million in 2024 and is forecast to a readjusted size of USD 13500 million by 2031 with a CAGR of 9.4% during review period.
Semiconductor inspection runs through the entire semiconductor process, that is, the front-end and back-end. Semiconductor inspection includes optical inspection, electron beam inspection and X-ray measurement. It mainly detects whether there are abnormal quality conditions on the surface of the wafer or in the circuit structure, such as scratches, particle contamination, graphic errors and other defects. Different inspection technologies have obvious differences, mainly reflected in accuracy, speed and inspection purposes.
Semiconductor inspection types include patterned, non-patterned and mask inspection. Among them, patterned defect inspection is divided into bright field and dark field inspection. Both are analyzed through optical signals. The difference is that the bright field is a vertically reflected light signal, while the dark field is a scattered light signal.
Semiconductor optical inspection mainly refers to automatic optical inspection (AOI), which is a key technology with a wide range of uses in wafer manufacturing. Optical inspection is non-contact and has minimal destructiveness to the wafer itself; by performing batch and rapid inspection of wafers, it can meet the manufacturer's requirements for throughput. Optical profilers are also a type of optical inspection equipment, but they are significantly different from AOI equipment. The statistical scope of this article does not include optical profilers. Automatic optical inspection (AOI) is a detection method that obtains the image of the object under test through optical imaging, processes and analyzes it through a specific algorithm, and compares it with the standard template image to obtain the defects of the object under test. As the wafer size gradually shifts to 12 inches, the speed and accuracy of wafer defect detection are becoming more and more important. By replacing manual scratches and other appearance inspections with AOI systems, the speed and quality of wafer output can be improved, thereby reducing the output of scrapped products and reducing labor costs.
This article focuses on the statistics of equipment used for wafer defect inspection, such as patterned wafer defect inspection, non-patterned wafer defect inspection, electron beam wafer defect inspection and X-ray wafer defect inspection.
The global key manufacturers of Wafer Defect Inspection System include KLA Corporation, Applied Materials, ASML, Hitachi High-Tech Corporation, Onto Innovation, Camtek, Skyverse Technology, SCREEN Semiconductor Solutions, Lasertec, NEXTIN, etc. In 2023, the global top 10 players had a share approximately 92.0% in terms of revenue.
In Patterned Wafer Defect Inspection Systems segment are dominated by KLA and Applied Materials;
Unpatterned Wafer Inspection Systems are dominated by KLA and Hitachi High-Tech Corporation; e-Beam Wafer Defect Review and Classification Systems are dominated by ASML and Applied Materials.
The global market for semiconductor was estimated at US$ 526.8 billion in the year 2023, is projected to US$ 780.7 billion by 2030. IC Manufacturing is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM). According to our research, the global semiconductor manufacturing (wafer fabrication) market is projected to grow from US$ 251.7 billion in 2023 to US$ 506.5 billion by 2030, at a Compound Annual Growth Rate (CAGR) of 40.49% during the forecast period. This will drive rapid growth of global Wafer Defect Inspection System.
This report is a detailed and comprehensive analysis for global Semiconductor Wafer Defect Inspection Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Semiconductor Wafer Defect Inspection Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Semiconductor Wafer Defect Inspection Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Semiconductor Wafer Defect Inspection Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Semiconductor Wafer Defect Inspection Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Semiconductor Wafer Defect Inspection Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Semiconductor Wafer Defect Inspection Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include KLA Corporation, Applied Materials, Lasertec, Hitachi High-Tech Corporation, ASML, Onto Innovation, Camtek, SCREEN Semiconductor Solutions, Skyverse Technology, Toray Engineering, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Semiconductor Wafer Defect Inspection Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Patterned Wafer Defect Inspection System
Non-patterned Wafer Defect Inspection System
E-beam Wafer Defect Inspection and Classification System
Wafer Macro Defects Detection and Classification
Wafer Inspection System for Advanced Packaging
Market segment by Application
300mm Wafer Size
200mm Wafer Size
Others
Major players covered
KLA Corporation
Applied Materials
Lasertec
Hitachi High-Tech Corporation
ASML
Onto Innovation
Camtek
SCREEN Semiconductor Solutions
Skyverse Technology
Toray Engineering
NEXTIN
Suzhou TZTEK (Muetec)
Microtronic
Bruker
SMEE
Hangzhou Changchuan Technology
Wuhan Jingce Electronic Group
Angkun Vision (Beijing) Technology
Nanotronics
Visiontec Group
Hefei Yuwei Semiconductor Technology
Suzhou Secote (Optima)
DJEL
Jiangsu VPTEK
Ever Red New Technology
Confovis
Zhongdao Optoelectronic
Suzhou Xinshi Technology
RSIC scientific instrument (Shanghai)
Gaoshi Technology (Suzhou)
Unity Semiconductor SAS
JUTZE Intelligence Technology
Chroma ATE Inc
CMIT
Engitist Corporation
HYE Technology
Shuztung Group
Cortex Robotics
Takano
Shanghai Techsense
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Semiconductor Wafer Defect Inspection Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Semiconductor Wafer Defect Inspection Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Wafer Defect Inspection Equipment from 2020 to 2025.
Chapter 3, the Semiconductor Wafer Defect Inspection Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Semiconductor Wafer Defect Inspection Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Wafer Defect Inspection Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Wafer Defect Inspection Equipment.
Chapter 14 and 15, to describe Semiconductor Wafer Defect Inspection Equipment sales channel, distributors, customers, research findings and conclusion.
Learn how to effectively navigate the market research process to help guide your organization on the journey to success.
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