Global Semiconductor Packaging and Testing Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Global Semiconductor Packaging and Testing Equipment Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Semiconductor Packaging and Testing Equipment market size was valued at US$ 13870 million in 2024 and is forecast to a readjusted size of USD 21090 million by 2031 with a CAGR of 5.9% during review period.

Packaging is the process of laying out, fixing and connecting the chip on the substrate, and encapsulating it with a plastic insulating medium to form an electronic product. The purpose is to protect the chip from damage, ensure the heat dissipation performance of the chip, and realize the transmission of electrical energy and electrical signals to ensure the normal operation of the system. The specific processing links of semiconductor packaging mainly include grinding, wafer cutting, wire bonding, plastic sealing, electroplating, cutting/molding and other links. The packaging equipment mainly includes mounters, cutting and thinning equipment, wire machines, bonding machines, electroplating equipment, etc.

Testing is mainly a step to verify the functions and performance of semiconductor products such as chips and circuits. Its purpose is to screen out semiconductor products with structural defects and functions and performance that do not meet the requirements to ensure the normal application of the delivered products. Testing equipment mainly includes testers, probe stations and sorting machines.

Strong market demand and strong support from national policies are the main driving forces for the rapid development of the domestic semiconductor industry. Mainland China is the world's largest market for semiconductor products, mainly because it is the world's factory. The main production bases of electronic products such as televisions, computers, mobile phones, and home appliances are located in the mainland. Therefore, the mainland consumes about half of the world's semiconductor products. On the other hand, with the rise of terminal brand manufacturers in mainland China, the demand for semiconductor products from mainland own-brand manufacturers has increased significantly. The growth of domestic semiconductor and microelectronics market demand has driven the development of the semiconductor packaging industry. The semiconductor and microelectronics industry is in a continuous development cycle. The market demand for electronic information products such as computers, communications, and consumer electronics drives the development of the integrated circuit industry. The development of the semiconductor and microelectronics industry drives the development of the semiconductor packaging and testing equipment industry.

In terms of product types and technologies, semiconductor packaging equipment accounts for a high proportion, with a market size of US$7.843 billion in 2023, accounting for approximately 53.94% of total sales. In terms of product market applications, packaging and testing & wafer foundries account for a high proportion, with a market size of US$11.002 billion in 2023, accounting for approximately 75.68% of total sales

The continuous increase in downstream demand has led to the emergence of a number of new companies in the semiconductor field. In order to save costs and increase gross profit margins, these start-ups will choose to outsource their semiconductor manufacturing and packaging and testing to wafer and packaging and testing foundries. The booming packaging and testing foundry business has also led to an increasing demand for semiconductor packaging and testing equipment from wafer and packaging and testing foundries. We believe that the trend of packaging and testing outsourcing will not change in the short term, so the application of semiconductor packaging and testing equipment in this field is showing a slight growth trend.

This report is a detailed and comprehensive analysis for global Semiconductor Packaging and Testing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Semiconductor Packaging and Testing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Semiconductor Packaging and Testing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Semiconductor Packaging and Testing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Semiconductor Packaging and Testing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Packaging and Testing Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Packaging and Testing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Teradyne, Advantest, ASM Pacific Technology, Disco, Tokyo Seimitsu, Besi, Tokyo Electron, Kulicke & Soffa Industries, Cohu, Semes, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Semiconductor Packaging and Testing Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Semiconductor Testing Equipment
Semiconductor Packaging Equipment

Market segment by Application
IDM Enterprise
Foundry

Major players covered
Teradyne
Advantest
ASM Pacific Technology
Disco
Tokyo Seimitsu
Besi
Tokyo Electron
Kulicke & Soffa Industries
Cohu
Semes
Hanmi semiconductor
Yamaha Robotics Holdings
Techwing
Fasford (FUJI)
Chroma
CCTECH
Beijing Huafeng Test & Control Technology
Toray Engineering
Palomar Technologies
Shibasoku
SPEA
Hesse
Unicomp Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Packaging and Testing Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Packaging and Testing Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Packaging and Testing Equipment from 2020 to 2025.

Chapter 3, the Semiconductor Packaging and Testing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Packaging and Testing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Packaging and Testing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging and Testing Equipment.

Chapter 14 and 15, to describe Semiconductor Packaging and Testing Equipment sales channel, distributors, customers, research findings and conclusion.