Global Semiconductor Packaging and Testing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Semiconductor Packaging and Testing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, the global Semiconductor Packaging and Testing Equipment market size was valued at US$ 12700 million in 2023 and is forecast to a readjusted size of USD 18840 million by 2030 with a CAGR of 5.9% during review period.

Global Semiconductor Packaging and Testing Equipment key players include TEL, Advantest, ASM Pacific Technology, Disco, Tokyo Seimitsu Co., Ltd, etc. Global top 5 manufacturers hold a share over 58%.

China Taiwan is the largest market, with a share about 31%, followed by North America, and China, both have a share about 46 percent.

In terms of product, Semiconductor Packaging Equipment is the largest segment, with a share over 58%. And in terms of application, the largest application is Sealing Test and Foundry Wafer.

This report is a detailed and comprehensive analysis for global Semiconductor Packaging and Testing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Semiconductor Packaging and Testing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030

Global Semiconductor Packaging and Testing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030

Global Semiconductor Packaging and Testing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2019-2030

Global Semiconductor Packaging and Testing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Packaging and Testing Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Packaging and Testing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TEL, DISCO, ASM, Tokyo Seimitsu, Besi, Semes, Cohu, Inc., Techwing, Kulicke & Soffa Industries, Fasford, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Semiconductor Packaging and Testing Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Prober
Bonder
Dicing Machine
Sorter
Handler
Others

Market segment by Application
Packaging
Test

Major players covered
TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation
Tokyo Electron Ltd
FormFactor
MPI
Electroglas
Wentworth Laboratories
Hprobe
Palomar Technologies
Toray Engineering
Multitest
Boston Semi Equipment
Seiko Epson Corporation
Hon Technologies

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Packaging and Testing Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Packaging and Testing Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Packaging and Testing Equipment from 2019 to 2024.

Chapter 3, the Semiconductor Packaging and Testing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Packaging and Testing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Semiconductor Packaging and Testing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging and Testing Equipment.

Chapter 14 and 15, to describe Semiconductor Packaging and Testing Equipment sales channel, distributors, customers, research findings and conclusion.