Global Semiconductor Packaging and Test Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Semiconductor Packaging and Test Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

The rapid expansion of semiconductor chip application is one of the primary factors contributing to the growth of the semiconductor packaging and test market in China. The use of semiconductor chips has expanded broadly with rising demands from various industries such as power, energy, medical, green cars, networking and telecommunications, LED lighting, automobile, consumer applications, military, aerospace and defense, motor control applications, and robotics.

According to our (Global Info Research) latest study, the global Semiconductor Packaging and Test Equipment market size was valued at US$ 12700 million in 2023 and is forecast to a readjusted size of USD 18840 million by 2030 with a CAGR of 5.9% during review period.

In China and China Taiwan, Semiconductor Packaging and Test Equipment key players include TEL, DISCO, ASM, etc. China and China Taiwan top three manufacturers hold a share over 40%.

In terms of product, Wafer Probe Station is the largest segment of Cobalt, with a share over 35%. And in terms of application, the largest application is OSAT, followed by IDMs.

This report is a detailed and comprehensive analysis for global Semiconductor Packaging and Test Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Semiconductor Packaging and Test Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030

Global Semiconductor Packaging and Test Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030

Global Semiconductor Packaging and Test Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K USD/Unit), 2019-2030

Global Semiconductor Packaging and Test Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K USD/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Packaging and Test Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Packaging and Test Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include TEL, DISCO, ASM, Tokyo Seimitsu, Besi, Semes, Cohu, Inc., Techwing, Kulicke & Soffa Industries, Fasford, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Semiconductor Packaging and Test Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Wafer Probe Station
Die Bonder
Dicing Machine
Test handler
Sorter

Market segment by Application
Integrated Device Manufacturer (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

Major players covered
TEL
DISCO
ASM
Tokyo Seimitsu
Besi
Semes
Cohu, Inc.
Techwing
Kulicke & Soffa Industries
Fasford
Advantest
Hanmi semiconductor
Shinkawa
Shen Zhen Sidea
DIAS Automation

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Packaging and Test Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Packaging and Test Equipment, with price, sales quantity, revenue, and global market share of Semiconductor Packaging and Test Equipment from 2019 to 2024.

Chapter 3, the Semiconductor Packaging and Test Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Packaging and Test Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Semiconductor Packaging and Test Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging and Test Equipment.

Chapter 14 and 15, to describe Semiconductor Packaging and Test Equipment sales channel, distributors, customers, research findings and conclusion.