Global Semiconductor Packaging Used Solder Paste Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Semiconductor Packaging Used Solder Paste Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

According to our (Global Info Research) latest study, the global Semiconductor Packaging Used Solder Paste market size was valued at USD 333 million in 2023 and is forecast to a readjusted size of USD 395.5 million by 2030 with a CAGR of 2.5% during review period.

Solder paste is a suspension of solder particles in a solder flux, which is widely used in the electronic assembly materials.

At present, in the industrial developed countries the solder paste industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the USA, Europe and Japan. Meanwhile, these companies have more mature equipment, strong R & D capability, and the technical level is in a leading position. Solder Paste industry is a low concentration industry. As electronic foundry industry transfer to China mainland, many new entrants enter into this industry. At present, some Chinese enterprises occupy a relatively large international market share. Chinese companies represented by Tongfang Tech and Shenzhen Vital New Material have successively built standard chemical production bases, which have a strong first-mover advantage. Of the global major players of Solder Paste, MacDermid Alpha Electronics Solutions, Senju Metal Industry and Harima Chemicals captured the top three revenue share spots in the Solder Paste market in 2021. MacDermid Alpha Electronics Solutions dominated with 14.66% revenue share in 2021 with the acquision of Kester, followed by Senju Metal Industry and Harima Chemicals with 12.22% and 6.61% revenue share, respectively. It is worth noting that Harima Chemicals acquired the solder paste business of Heraeus in June 2022. This report combines the data of the two companies for statistics.



The solder paste industry is a mature industry. The largest sales market is China, due to the rapidly development of electronics industry, with 51.73% share in 2022. The demand in other region, such as Southeast Asia, is increasing rapidly. While in the electronics mature region, such as USA, Europe, the demanding of solder paste decline gradually, due to the production transfer of electronics products.

The Global Info Research report includes an overview of the development of the Semiconductor Packaging Used Solder Paste industry chain, the market status of 3C Electronic Products (Leaded Solder Paste, Lead-free Solder Paste), Automotive (Leaded Solder Paste, Lead-free Solder Paste), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Semiconductor Packaging Used Solder Paste.

Regionally, the report analyzes the Semiconductor Packaging Used Solder Paste markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Semiconductor Packaging Used Solder Paste market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Semiconductor Packaging Used Solder Paste market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Semiconductor Packaging Used Solder Paste industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K MT), revenue generated, and market share of different by Type (e.g., Leaded Solder Paste, Lead-free Solder Paste).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Semiconductor Packaging Used Solder Paste market.

Regional Analysis: The report involves examining the Semiconductor Packaging Used Solder Paste market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Semiconductor Packaging Used Solder Paste market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Semiconductor Packaging Used Solder Paste:

Company Analysis: Report covers individual Semiconductor Packaging Used Solder Paste manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Semiconductor Packaging Used Solder Paste This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (3C Electronic Products, Automotive).

Technology Analysis: Report covers specific technologies relevant to Semiconductor Packaging Used Solder Paste. It assesses the current state, advancements, and potential future developments in Semiconductor Packaging Used Solder Paste areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Semiconductor Packaging Used Solder Paste market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Semiconductor Packaging Used Solder Paste market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type
By Alloy Powder Components
Leaded Solder Paste
Lead-free Solder Paste
By Flux Composition
Rosin Based Pastes
Water Soluble Fluxes
No-clean Flux
By Melting Points
High Temperature Solder Paste
Medium Temperature Solder Paste
Low Temperature Solder Paste

Market segment by Application
3C Electronic Products
Automotive
Industrial
Medical
Military/Aerospace

Major players covered
MacDermid Alpha Electronics Solutions
Senju Metal Industry
Harima Chemicals
Heraeus
Tongfang Tech
AIM
Shenzhen Vital New Material
Indium
Tamura
Shengmao
KOKI
Inventec Performance Chemicals
Nihon Superior
Shenzhen Chenri Technology
DS HiMetal
Yashida
Yong An

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Packaging Used Solder Paste product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Packaging Used Solder Paste, with price, sales, revenue and global market share of Semiconductor Packaging Used Solder Paste from 2019 to 2024.

Chapter 3, the Semiconductor Packaging Used Solder Paste competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Packaging Used Solder Paste breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Semiconductor Packaging Used Solder Paste market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging Used Solder Paste.

Chapter 14 and 15, to describe Semiconductor Packaging Used Solder Paste sales channel, distributors, customers, research findings and conclusion.