Global Semiconductor Packaging Materials Market 2025 by Company, Regions, Type and Application, Forecast to 2031

Global Semiconductor Packaging Materials Market 2025 by Company, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Semiconductor Packaging Materials market size was valued at US$ 31540 million in 2024 and is forecast to a readjusted size of USD 72160 million by 2031 with a CAGR of 12.7% during review period.

Semiconductor packaging has four main functions: protection, support, connection and reliability. It protects the chip to operate normally in various environments, supports the chip to facilitate connection with the circuit, and connects the electrode of the chip with the external circuit to form reliability and can Used in various applications. This report focusses on Semiconductor Packaging Materials market.

A semiconductor is a substance that conducts electricity under some but not all circumstances. Manufacturers are able to customize the conductivity of a semiconductor, such as introducing a sensitivity to heat or light, or altering conductivity based on the direction of the current. Semiconductors are an important component of many commonly used electronic devices including smartphones, tablets, and PCs. Notable semiconductor chip makers include Intel and Samsung Electronics, with Intel generating 48.7 billion U.S. dollars and Samsung generating 39.9 billion U.S. dollars in semiconductor revenue in 2023, placing them among the largest companies in terms of semiconductor industry revenues. The semiconductor industry comprises companies that design, fabricate, assemble, test, and supply semiconductors that are suitable for various applications. In 2024, semiconductor sales were expected to reach 611.23 billion U.S. dollars worldwide. Semiconductors are crucial components of electronics devices and the industry is highly competitive. The year-on-year decline rate in 2023 equated to 9.4 percent, although a swift recovery is expected in 2024 with growth of 16 percent. The growing global consumer electronics consumption further supports the market growth. In addition, the development of artificial intelligence (AI), the Internet of Things (IoT), and machine learning (ML) technologies in the new age of electronic systems is generating lucrative market growth opportunities. These technologies assist and enhance memory chip processing time to process large amounts of data in no time. Moreover, the potentially rising demand for faster and more advanced memory chips in data center applications is expected to drive the market growth over the forecast timeline. Global Semiconductor Packaging Materials includes Kyocera, Shinko, and Ibiden, etc. Global top three companies hold a share over 22%.

This report is a detailed and comprehensive analysis for global Semiconductor Packaging Materials market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Semiconductor Packaging Materials market size and forecasts, in consumption value ($ Million), 2020-2031

Global Semiconductor Packaging Materials market size and forecasts by region and country, in consumption value ($ Million), 2020-2031

Global Semiconductor Packaging Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031

Global Semiconductor Packaging Materials market shares of main players, in revenue ($ Million), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Packaging Materials

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Packaging Materials market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Kyocera, Shinko, Ibiden, LG Innotek, Unimicron Technology, ZhenDing Tech, Semco, KINSUS INTERCONNECT TECHNOLOGY, Nan Ya PCB, Nippon Micrometal Corporation, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Semiconductor Packaging Materials market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Packaging Substrate
Lead Frame
Bonding Wire
Encapsulating Resin
Ceramic Packaging Material
Chip Bonding Material
Others

Market segment by Application
Consume Electrons
Automobiles
Communications
Medical
Others

Market segment by players, this report covers
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
KINSUS INTERCONNECT TECHNOLOGY
Nan Ya PCB
Nippon Micrometal Corporation
Simmtech
Mitsui High-tec, Inc.
HAESUNG
Shin-Etsu
Heraeus
AAMI
Henkel
Shennan Circuits
Kangqiang Electronics
LG Chem
NGK/NTK
MK Electron
Toppan Printing Co., Ltd.
Tanaka
MARUWA
Momentive
SCHOTT
Element Solutions
Hitachi Chemical
Fastprint
Hongchang Electronic
Sumitomo

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Semiconductor Packaging Materials product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Semiconductor Packaging Materials, with revenue, gross margin, and global market share of Semiconductor Packaging Materials from 2020 to 2025.

Chapter 3, the Semiconductor Packaging Materials competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Semiconductor Packaging Materials market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Semiconductor Packaging Materials.

Chapter 13, to describe Semiconductor Packaging Materials research findings and conclusion.