Global Semiconductor Molding Systems Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Semiconductor Molding Systems market size was valued at US$ 419 million in 2024 and is forecast to a readjusted size of USD 650 million by 2031 with a CAGR of 5.9% during review period.

The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging and testing. Packaging refers to cutting, wire bonding, molding, trim & forming the wafer after production and processing, so that the integrated circuit can achieve electrical and signal connections with external devices while providing physical and chemical protection for the integrated circuit. Molding refers to a plastic molding process in which packaging materials such as epoxy resin mixture are injected into the mold cavity at a certain temperature and pressure, and the devices that need to be protected, such as chips, are wrapped in the plastic, and then solidified into a whole body. The roles of Molding products in semiconductor packaging are as follows: 1. Protective effect. Exposed semiconductor chips will not fail under strict environmental control, but the daily environment does not have the required environmental control conditions at all, so the chips need to be protected by packaging. 2. Supporting effect. The support has two functions. One is to support the chip, which is to fix the chip to facilitate circuit connection. The other is to form a certain shape to support the entire device after the packaging is completed, making the entire device less likely to be damaged. 3. Connection function. The function of the connection is to connect the electrodes of the chip to the external circuit, the pin is used to connect the external circuit, and the gold wire connects the pin to the circuit of the chip. The carrier stage is used to carry the chip, the epoxy resin adhesive is used to stick the chip on the carrier stage, the pins are used to support the entire device, and the plastic package plays a role in fixing and protecting it. 4. Ensure reliability. Any packaging needs to have a certain degree of reliability, which is the most important metric in the entire packaging process.

Gobal key players of Semiconductor Molding System market include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, etc. The top five players hold a share about 88%. Asia-Pacific is the largest market, has a share about 82%, followed by North America, and Europe, with share 12% and 5%, separately. In terms of product type, Fully Automatic is the largest segment, occupied for a share of 64%. In terms of application, Advanced Packaging has a share about 51%.

This report is a detailed and comprehensive analysis for global Semiconductor Molding Systems market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Semiconductor Molding Systems market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Semiconductor Molding Systems market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Semiconductor Molding Systems market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Semiconductor Molding Systems market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Molding Systems

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Molding Systems market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Towa, Besi, ASMPT, I-PEX Inc, Tongling Trinity Technology, Shanghai Xinsheng, Mtex Matsumura, Asahi Engineering, Nextool Technology Co., Ltd., APIC YAMADA, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Semiconductor Molding Systems market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Fully Automatic Molding System
Semi-automatic Molding System
Manual Molding System

Market segment by Application
Advanced Packaging
Traditional Packaging

Major players covered
Towa
Besi
ASMPT
I-PEX Inc
Tongling Trinity Technology
Shanghai Xinsheng
Mtex Matsumura
Asahi Engineering
Nextool Technology Co., Ltd.
APIC YAMADA
Suzhou Bopai Semiconductor (Boschman)
Anhui Zhonghe

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Molding Systems product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Molding Systems, with price, sales quantity, revenue, and global market share of Semiconductor Molding Systems from 2020 to 2025.

Chapter 3, the Semiconductor Molding Systems competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Molding Systems breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Molding Systems market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Molding Systems.

Chapter 14 and 15, to describe Semiconductor Molding Systems sales channel, distributors, customers, research findings and conclusion.