Global Semiconductor Laser Annealing Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Semiconductor Laser Annealing Machine market size was valued at US$ 936 million in 2024 and is forecast to a readjusted size of USD 1839 million by 2031 with a CAGR of 10.4% during review period.

In the manufacturing process of semiconductor devices, in order to form specific doping in silicon wafers, multiple ion implantation processes are required during the manufacturing process. During the ion input process, the bombardment of impurity ions will cause a certain degree of lattice damage to the silicon atoms in the wafer, resulting in the impurity ions not being able to be located in the correct lattice position and not having the proper electrical activity. Therefore, the wafer needs to be heat treated to repair the lattice and activate the electrical activity of the impurity ions. This heat treatment process is called annealing.

Semiconductor laser annealing machine refers to special equipment that uses high-energy laser beams for automated annealing processes. Its main function is to project a beam spot of a specific shape and uniform energy distribution onto a semiconductor wafer to anneal, scan and process the wafer. Compared with traditional furnace annealing and rapid annealing technology, laser annealing has the advantages of high instantaneous temperature, short action time, low thermal budget, and optional area processing, which can better meet the process requirements of thin-film processing and efficient activation. At present, laser annealing equipment has been widely used in the field of cutting-edge logic chip manufacturing.

Semiconductor Laser Annealing Machine can be divided into power laser annealing equipment and IC front-end laser annealing equipment. Power laser annealing equipment accounts for more than half, and IC front-end laser annealing equipment has the fastest growth rate. In 2023, the power annealing market share is about 55%. IGBT has become one of the fastest-growing power devices with its excellent performance. With the maturity of wafer thinning technology, thin-film high-voltage IGBT will become a future development trend; in addition, as the research and development of the third-generation wide bandgap semiconductor material SiC becomes more mature, the demand for SiC devices will gradually increase. Laser annealing technology is suitable for thin-film high-voltage IGBT and SiC products, and will continue to be one of the mainstream technologies in the future.

The development of the semiconductor laser annealing machine market is mainly driven by the downstream power device market and the advanced process chip market. In the field of power devices, power devices can be divided into traditional silicon-based devices and wide bandgap material devices according to material type. At present, silicon-based devices with a wide application base will still be the mainstream products for a long time in the future, such as IGBT. Benefiting from the development of industrial control, frequency conversion, and new energy industries, my country's power device industry will maintain steady growth. In addition, as the world's largest IGBT market, China has a large space for import substitution, and the acceleration of the localization process will benefit domestic equipment manufacturers.

The major semiconductor laser annealing machine manufacturers in the global market include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Applied Materials and Veeco, etc. The top five companies in the world account for nearly 87% of the market. The overall market concentration is high, and most of the high-end market is monopolized by foreign companies. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.

This report is a detailed and comprehensive analysis for global Semiconductor Laser Annealing Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Semiconductor Laser Annealing Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global Semiconductor Laser Annealing Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global Semiconductor Laser Annealing Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031

Global Semiconductor Laser Annealing Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Laser Annealing Machine

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Laser Annealing Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Veeco, Applied Materials, Hitachi, YAC BEAM, Shanghai Micro Electronics Equipment, EO Technics, Beijing U-PRECISION Tech, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Semiconductor Laser Annealing Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

Power Laser Annealing Machine

IC Front-end Laser Annealing Machine

Market segment by Application

Power Semiconductor

Advanced Process Chip

Major players covered

Mitsui Group (JSW)

Sumitomo Heavy Industries

SCREEN Semiconductor Solutions

Veeco

Applied Materials

Hitachi

YAC BEAM

Shanghai Micro Electronics Equipment

EO Technics

Beijing U-PRECISION Tech

Chengdu Laipu Technology

Hans DSI

ETA Semitech

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Laser Annealing Machine product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Laser Annealing Machine, with price, sales quantity, revenue, and global market share of Semiconductor Laser Annealing Machine from 2020 to 2025.

Chapter 3, the Semiconductor Laser Annealing Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Laser Annealing Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Semiconductor Laser Annealing Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Laser Annealing Machine.

Chapter 14 and 15, to describe Semiconductor Laser Annealing Machine sales channel, distributors, customers, research findings and conclusion.