Global Semiconductor Grade Encapsulants Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Semiconductor Grade Encapsulants Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Semiconductor grade encapsulants are used to protect electronic devices in the harshest operating conditions protecting from chemicals, dust, heat, water, corrosive atmospheres, physical shock, or just the general environment. The materials are used to either "encapsulate" individual components, or "pot" the entire unit.

According to our (Global Info Research) latest study, the global Semiconductor Grade Encapsulants market size was valued at US$ 3705 million in 2023 and is forecast to a readjusted size of USD 5081 million by 2030 with a CAGR of 4.7% during review period.

World top 3 the largest players of semiconductor grade encapsulants hold a share over 30%, other key players include Shin-Etsu Chemical, Nagase, and CHT Group, etc. Asia-Pacific is the largest market, occupied for over 45 percent, followed by North America. In terms of material, silicone is the largest segment, with a share about 40%, and in terms of end user, the consumer electronic segment holds share around 50 percent.

This report is a detailed and comprehensive analysis for global Semiconductor Grade Encapsulants market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Semiconductor Grade Encapsulants market size and forecasts, in consumption value ($ Million), sales quantity (K Tons), and average selling prices (US$/Ton), 2019-2030

Global Semiconductor Grade Encapsulants market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Tons), and average selling prices (US$/Ton), 2019-2030

Global Semiconductor Grade Encapsulants market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Tons), and average selling prices (US$/Ton), 2019-2030

Global Semiconductor Grade Encapsulants market shares of main players, shipments in revenue ($ Million), sales quantity (K Tons), and ASP (US$/Ton), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Semiconductor Grade Encapsulants

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Semiconductor Grade Encapsulants market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Dow Corning, Shin-Etsu Chemical, Momentive, Element Solutions, Nagase, CHT Group, H.B. Fuller, Wacker Chemie AG, Elkem Silicones, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Semiconductor Grade Encapsulants market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Silicone
Epoxy
Polyurethane

Market segment by Application
Automotive
Consumer Electronics
Others

Major players covered
Henkel
Dow Corning
Shin-Etsu Chemical
Momentive
Element Solutions
Nagase
CHT Group
H.B. Fuller
Wacker Chemie AG
Elkem Silicones
Elantas
Lord
Showa Denka
Namics Corporation
Won Chemical
Panacol

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Semiconductor Grade Encapsulants product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Semiconductor Grade Encapsulants, with price, sales quantity, revenue, and global market share of Semiconductor Grade Encapsulants from 2019 to 2024.

Chapter 3, the Semiconductor Grade Encapsulants competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Semiconductor Grade Encapsulants breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Semiconductor Grade Encapsulants market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Semiconductor Grade Encapsulants.

Chapter 14 and 15, to describe Semiconductor Grade Encapsulants sales channel, distributors, customers, research findings and conclusion.