Global Quad-Flat-No-Lead Packaging (QFN) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Quad-Flat-No-Lead Packaging (QFN) Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Quad-Flat-No-Lead (QFN) packaging is a type of surface-mount integrated circuit (IC) package that provides a compact and low-profile solution for electronic components. It is widely used in various industries, including consumer electronics, telecommunications, automotive, and industrial applications.

QFN packages are designed to have no leads protruding from the sides. Instead, the electrical connections are made through metal pads on the bottom surface of the package. This design allows for a smaller package size and improved thermal and electrical performance compared to traditional leaded packages.

QFN packaging has gained popularity in the electronics industry due to its compact size, good thermal performance, and reliability. It enables the development of smaller and more powerful electronic devices while optimizing space utilization on PCBs.

According to our (Global Info Research) latest study, the global Quad-Flat-No-Lead Packaging (QFN) market size was valued at US$ 3903 million in 2023 and is forecast to a readjusted size of USD 4439 million by 2030 with a CAGR of 1.9% during review period.

Global key players of Quad-Flat-No-Lead Packaging(QFN) include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc. and Tongfu Microelectronics, etc. Top five players occupy for a share about 70%. Asia-Pacific is the largest market, with a share about 77%, followed by Europe and North America. In terms of product, Sawn Type is the largest segment, with a share over 63%. In terms of Package Size, Above 5x5 to 7x7 is the largest market, with a share over 28%.

This report is a detailed and comprehensive analysis for global Quad-Flat-No-Lead Packaging (QFN) market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Quad-Flat-No-Lead Packaging (QFN) market size and forecasts, in consumption value ($ Million), sales quantity (KK PCS), and average selling prices (US$/K PCS), 2019-2030

Global Quad-Flat-No-Lead Packaging (QFN) market size and forecasts by region and country, in consumption value ($ Million), sales quantity (KK PCS), and average selling prices (US$/K PCS), 2019-2030

Global Quad-Flat-No-Lead Packaging (QFN) market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (KK PCS), and average selling prices (US$/K PCS), 2019-2030

Global Quad-Flat-No-Lead Packaging (QFN) market shares of main players, shipments in revenue ($ Million), sales quantity (KK PCS), and ASP (US$/K PCS), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Quad-Flat-No-Lead Packaging (QFN)

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Quad-Flat-No-Lead Packaging (QFN) market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASE(SPIL), Amkor Technology, JCET Group, Powertech Technology Inc., Tongfu Microelectronics, Tianshui Huatian Technology, UTAC, Orient Semiconductor, ChipMOS, King Yuan Electronics, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Quad-Flat-No-Lead Packaging (QFN) market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Punched Type
Sawn Type

Market segment by Application
Automotive
Consumer Electronics
Industrial
Communications
Others

Major players covered
ASE(SPIL)
Amkor Technology
JCET Group
Powertech Technology Inc.
Tongfu Microelectronics
Tianshui Huatian Technology
UTAC
Orient Semiconductor
ChipMOS
King Yuan Electronics
SFA Semicon

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Quad-Flat-No-Lead Packaging (QFN) product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Quad-Flat-No-Lead Packaging (QFN), with price, sales quantity, revenue, and global market share of Quad-Flat-No-Lead Packaging (QFN) from 2019 to 2024.

Chapter 3, the Quad-Flat-No-Lead Packaging (QFN) competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Quad-Flat-No-Lead Packaging (QFN) breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Quad-Flat-No-Lead Packaging (QFN) market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Quad-Flat-No-Lead Packaging (QFN).

Chapter 14 and 15, to describe Quad-Flat-No-Lead Packaging (QFN) sales channel, distributors, customers, research findings and conclusion.