Global Production Equipment for IC Substrate Market 2023 by Company, Regions, Type and Application, Forecast to 2029

Global Production Equipment for IC Substrate Market 2023 by Company, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global Production Equipment for IC Substrate market size was valued at USD 1856.2 million in 2022 and is forecast to a readjusted size of USD 2519.2 million by 2029 with a CAGR of 4.5% during review period.

This report studies the Production Equipment for IC Substrates, include the Direct Imaging Exposure System, Drilling Machine, AOI, Routing Machine, AVI, ABF Film Laminator, VCP Equipment, Flying Probe Tester, and PTH, etc. Currently FC-BGA (ABF) is the largest and fastest-growing segment of IC Substrate, driven by the demand from PCs, server, AI Chips, Data Center, HPC Chips, and Communication, etc.

The Global Info Research report includes an overview of the development of the Production Equipment for IC Substrate industry chain, the market status of FC-BGA (ABF) (Direct Imaging Exposure System/LDI, Drilling Machine for IC Substrate), FC-CSP (Direct Imaging Exposure System/LDI, Drilling Machine for IC Substrate), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Production Equipment for IC Substrate.

Regionally, the report analyzes the Production Equipment for IC Substrate markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Production Equipment for IC Substrate market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the Production Equipment for IC Substrate market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Production Equipment for IC Substrate industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., Direct Imaging Exposure System/LDI, Drilling Machine for IC Substrate).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Production Equipment for IC Substrate market.

Regional Analysis: The report involves examining the Production Equipment for IC Substrate market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Production Equipment for IC Substrate market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to Production Equipment for IC Substrate:

Company Analysis: Report covers individual Production Equipment for IC Substrate players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Production Equipment for IC Substrate This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (FC-BGA (ABF), FC-CSP).

Technology Analysis: Report covers specific technologies relevant to Production Equipment for IC Substrate. It assesses the current state, advancements, and potential future developments in Production Equipment for IC Substrate areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Production Equipment for IC Substrate market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

Production Equipment for IC Substrate market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.

Market segment by Type
Direct Imaging Exposure System/LDI
Drilling Machine for IC Substrate
Automated Optical Inspection (AOI) for IC Substrate
Routing Machine for IC Substrate
Automated Vision Inspection (AVI) for IC Substrate
ABF Film Laminator
VCP Equipment
Flying Probe Tester
PTH
Others

Market segment by Application
FC-BGA (ABF)
FC-CSP
BGA/CSP
SiP and RF Modules
Others

Market segment by players, this report covers
Orbotech (KLA)
ADTEC
SCREEN
Chime Ball Technology
ORC Manufacturing
Manz (KLEO)
Ofuna Technology Co., Ltd.
Symtek Automation
C SUN
AMPOC
GROUP UP Industrial (GP)
Gallant Precision Machining (GPM)
Eclat Forever Company
Utechzone
Ta Liang Technology
MACHVISION Inc Co., LTD
GigaVis
CIMS
Favite
FUSEI MENIX
Mycronic (atg)
Circuit Fabology Microelectronics Equipment Co.,Ltd.
TZTEK Company
Han's Laser
Jiangsu Yingsu IC Equipment
Kun Shan Korbe Precision Equipment
Kunshan Dongwei Technology
INSPEC
Saki Corporation
Via Mechanics
MKS (ESI)
Tongtai Machine & Tool

Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Production Equipment for IC Substrate product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Production Equipment for IC Substrate, with revenue, gross margin and global market share of Production Equipment for IC Substrate from 2018 to 2023.

Chapter 3, the Production Equipment for IC Substrate competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and Production Equipment for IC Substrate market forecast, by regions, type and application, with consumption value, from 2024 to 2029.

Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Production Equipment for IC Substrate.

Chapter 13, to describe Production Equipment for IC Substrate research findings and conclusion.