Global Printed Circuit Board Laminate Market 2024 by Company, Regions, Type and Application, Forecast to 2030
According to our (Global Info Research) latest study, the global Printed Circuit Board Laminate market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of % during review period.
Lamination is a technique wherein the material is permanently assembled by heating, pressuring, welding, or by use of adhesives. This technique improves the properties of a material such as strength, durability, appearance, stability, and others. Printed circuit board (PCB) laminate involves lamination of a circuit with a non-conductive material. PCB laminates connect and support the electronic components using pads, conductive tracks, and other features etched from copper sheets laminated onto a non-conductive substrate. PCB laminations are widely used in one copper layer PCB, two copper layer PCB, or outer & inner layer PCB.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
The Global Info Research report includes an overview of the development of the Printed Circuit Board Laminate industry chain, the market status of Automotive (FR-4, High Tg Epoxy), Communications (FR-4, High Tg Epoxy), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Printed Circuit Board Laminate.
Regionally, the report analyzes the Printed Circuit Board Laminate markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Printed Circuit Board Laminate market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Printed Circuit Board Laminate market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Printed Circuit Board Laminate industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., FR-4, High Tg Epoxy).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Printed Circuit Board Laminate market.
Regional Analysis: The report involves examining the Printed Circuit Board Laminate market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Printed Circuit Board Laminate market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Printed Circuit Board Laminate:
Company Analysis: Report covers individual Printed Circuit Board Laminate players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Printed Circuit Board Laminate This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Automotive, Communications).
Technology Analysis: Report covers specific technologies relevant to Printed Circuit Board Laminate. It assesses the current state, advancements, and potential future developments in Printed Circuit Board Laminate areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Printed Circuit Board Laminate market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Printed Circuit Board Laminate market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Market segment by Type
FR-4
High Tg Epoxy
BT Epoxy
Polyimide
Copper Clad
Teflon
Other
Market segment by Application
Automotive
Communications
Industrial Electronics
Consumer Electronics
Aerospace & Defense
Others
Market segment by players, this report covers
Unimicron Technology Corp.
Nippon Mektron
Samsung Electro-Mechanics
Zhen Ding Technology Holding Limited
Young Poong Electronics Co., Ltd.
Daeduck Electronics Co., Ltd.
Ibiden Co., Ltd.
Tripod Technology Corporation
TTM Technologies, Inc.
Austria Technologie & Systemtechnik AG
Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Printed Circuit Board Laminate product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Printed Circuit Board Laminate, with revenue, gross margin and global market share of Printed Circuit Board Laminate from 2019 to 2024.
Chapter 3, the Printed Circuit Board Laminate competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Printed Circuit Board Laminate market forecast, by regions, type and application, with consumption value, from 2025 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Printed Circuit Board Laminate.
Chapter 13, to describe Printed Circuit Board Laminate research findings and conclusion.