Global Pressure-less Sintering Die Attach Adhesives Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Global Pressure-less Sintering Die Attach Adhesives Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global Pressure-less Sintering Die Attach Adhesives market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Pressureless sintered silver glue is suitable for chip packaging, semiconductor bonding and integrated circuits. It has the characteristics of high electrical conductivity, high thermal conductivity, and low organic residue. It has good bonding performance with copper, silver, gold and other metal materials. Especially suitable for packaging adhesive materials, large-scale integrated circuits, and high-power power supplies.

Pressure-less sintering is a conventional sintering method, which refers to a method of sintering by heating the product under normal pressure. This is the most commonly used and simplest sintering method.

This report is a detailed and comprehensive analysis for global Pressure-less Sintering Die Attach Adhesives market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Thermal Conductivity and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:

Global Pressure-less Sintering Die Attach Adhesives market size and forecasts, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/g), 2018-2029

Global Pressure-less Sintering Die Attach Adhesives market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/g), 2018-2029

Global Pressure-less Sintering Die Attach Adhesives market size and forecasts, by Thermal Conductivity and by Application, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/g), 2018-2029

Global Pressure-less Sintering Die Attach Adhesives market shares of main players, shipments in revenue ($ Million), sales quantity (Kg), and ASP (US$/g), 2018-2023

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Pressure-less Sintering Die Attach Adhesives

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Pressure-less Sintering Die Attach Adhesives market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Heraeus, Kyocera, Indium, Henkel and Namics, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market Segmentation

Pressure-less Sintering Die Attach Adhesives market is split by Thermal Conductivity and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Thermal Conductivity, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Thermal Conductivity
Up to 100 W/m-K
Up to 110 W/m-K
Other

Market segment by Application
Power Semiconductor Device
RF Power Device
High Performance LED
Others

Major players covered
Heraeus
Kyocera
Indium
Henkel
Namics
Advanced Joining Technology
Shenzhen Facemoore Technology
Beijing Nanotop Electronic Technology
TANAKA Precious Metals
Nihon Superior
Nihon Handa
Solderwell Advanced Materials
Guangzhou Xianyi Electronic Technology
ShareX (Zhejiang) New Material Technology
Pilotm New Materials (Suzhou)

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Pressure-less Sintering Die Attach Adhesives product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Pressure-less Sintering Die Attach Adhesives, with price, sales, revenue and global market share of Pressure-less Sintering Die Attach Adhesives from 2018 to 2023.

Chapter 3, the Pressure-less Sintering Die Attach Adhesives competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Pressure-less Sintering Die Attach Adhesives breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.

Chapter 5 and 6, to segment the sales by Thermal Conductivity and application, with sales market share and growth rate by thermal conductivity, application, from 2018 to 2029.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Pressure-less Sintering Die Attach Adhesives market forecast, by regions, thermal conductivity and application, with sales and revenue, from 2024 to 2029.

Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.

Chapter 13, the key raw materials and key suppliers, and industry chain of Pressure-less Sintering Die Attach Adhesives.

Chapter 14 and 15, to describe Pressure-less Sintering Die Attach Adhesives sales channel, distributors, customers, research findings and conclusion.