Global Power Semiconductor Module Heat Dissipation Substrate Supply, Demand and Key Producers, 2023-2029

Global Power Semiconductor Module Heat Dissipation Substrate Supply, Demand and Key Producers, 2023-2029

The global Power Semiconductor Module Heat Dissipation Substrate market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

The heat dissipation substrate is the core heat dissipation functional structure and channel of the IGBT power module, and is also an important component with high value in the module. The heat dissipation substrate of the vehicle standard power semiconductor module must have good thermal conductivity, matching thermal expansion coefficient with components such as chips and copper clad ceramic substrates, sufficient hardness and durability. The copper needle type heat dissipation substrate has a needle fin structure, which greatly increases the heat dissipation surface area and can achieve power The rate module forms a needle fin shaped direct cooling structure, effectively improving the heat dissipation performance of the module and promoting the miniaturization of the success rate semiconductor module. Due to the high requirements for heat dissipation efficiency and miniaturization of power semiconductor modules used in new energy vehicle motor controllers, they have been widely used in the field of new energy vehicles. Copper flat bottom heat dissipation substrate is a universal heat dissipation structure for power semiconductor modules in the traditional field, mainly used to transfer module heat outward and provide mechanical support for the module. This product has traditionally been used in industrial control and other fields, and is currently also used in emerging fields such as new energy generation and energy storage.

This report studies the global Power Semiconductor Module Heat Dissipation Substrate production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Power Semiconductor Module Heat Dissipation Substrate, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Power Semiconductor Module Heat Dissipation Substrate that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Power Semiconductor Module Heat Dissipation Substrate total production and demand, 2018-2029, (K Units)

Global Power Semiconductor Module Heat Dissipation Substrate total production value, 2018-2029, (USD Million)

Global Power Semiconductor Module Heat Dissipation Substrate production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (K Units)

Global Power Semiconductor Module Heat Dissipation Substrate consumption by region & country, CAGR, 2018-2029 & (K Units)

U.S. VS China: Power Semiconductor Module Heat Dissipation Substrate domestic production, consumption, key domestic manufacturers and share

Global Power Semiconductor Module Heat Dissipation Substrate production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (K Units)

Global Power Semiconductor Module Heat Dissipation Substrate production by Type, production, value, CAGR, 2018-2029, (USD Million) & (K Units)

Global Power Semiconductor Module Heat Dissipation Substrate production by Application production, value, CAGR, 2018-2029, (USD Million) & (K Units).

This reports profiles key players in the global Power Semiconductor Module Heat Dissipation Substrate market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Jentech Precision Industrial, Dana, Huangshan Googe, Amulaire Thermal Technology, DNP, Ferrotec and ZZCOOLER, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Power Semiconductor Module Heat Dissipation Substrate market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (K Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Power Semiconductor Module Heat Dissipation Substrate Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Power Semiconductor Module Heat Dissipation Substrate Market, Segmentation by Type
Copper Needle Type Heat Dissipation Substrate
Copper Flat Bottom Heat Dissipation Substrate

Global Power Semiconductor Module Heat Dissipation Substrate Market, Segmentation by Application
New Energy Vehicles
Industrial Control
New Energy Power Generation
Energy Storage
Others

Companies Profiled:
Jentech Precision Industrial
Dana
Huangshan Googe
Amulaire Thermal Technology
DNP
Ferrotec
ZZCOOLER

Key Questions Answered

1. How big is the global Power Semiconductor Module Heat Dissipation Substrate market?

2. What is the demand of the global Power Semiconductor Module Heat Dissipation Substrate market?

3. What is the year over year growth of the global Power Semiconductor Module Heat Dissipation Substrate market?

4. What is the production and production value of the global Power Semiconductor Module Heat Dissipation Substrate market?

5. Who are the key producers in the global Power Semiconductor Module Heat Dissipation Substrate market?