Global Power Electronic DCB & AMB Substrates Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Power Electronic DCB & AMB Substrates Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

DBC (Direct Bonded Copper) substrates are composed of a ceramic insulator, Al2O3 or AlN onto which pure copper metal is attached by a high temperature eutectic melting process and thus tightly and firmly joined to the ceramic. This report studies the DBC ceramic substrate, including the AlN DBC Ceramic Substrate and Al2O3 DBC Ceramic Substrate. Active Metal Brazing (AMB) is the latest developments in ceramic substrates and offers the ability to produce Heavy Copper with a AlN (Aluminium Nitride) or SiN (Silicon Nitride). The normal metallisation process is not used as AMB involves brazing pure copper on the ceramic in a high temperature vacuum brazing process. As well as offering a high reliability substrate with unique heat dissipation. The brazing technology also enables double sided copper weights of up to 800µm on thin ceramic substrates of just 0.25mm.

According to our (Global Info Research) latest study, the global Power Electronic DCB & AMB Substrates market size was valued at US$ 1041 million in 2023 and is forecast to a readjusted size of USD 3332 million by 2030 with a CAGR of 17.0% during review period.

Global key players of Power Electronic DCB & AMB Substrates include Rogers Corporation, Ferrotec, BYD, etc. The top three players hold a share over 56%. Asia Pacific is the largest market, with a share about 62%. In terms of product type, DBC Ceramic Substrates is the largest segment, occupied for a share of 51%. In terms of application, Automotive & EV/HEV is the largest, which has a share about 57 percent.

This report is a detailed and comprehensive analysis for global Power Electronic DCB & AMB Substrates market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Power Electronic DCB & AMB Substrates market size and forecasts, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Sq m), 2019-2030

Global Power Electronic DCB & AMB Substrates market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Sq m), 2019-2030

Global Power Electronic DCB & AMB Substrates market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Square Meters), and average selling prices (US$/Sq m), 2019-2030

Global Power Electronic DCB & AMB Substrates market shares of main players, shipments in revenue ($ Million), sales quantity (Square Meters), and ASP (US$/Sq m), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Power Electronic DCB & AMB Substrates

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Power Electronic DCB & AMB Substrates market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Rogers, NGK Electronics Devices, Heraeus Electronics, Jiangsu Fulehua Semiconductor Technology, Toshiba Materials, Denka, Proterial, Mitsubishi Materials, Kyocera, DOWA METALTECH, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Power Electronic DCB & AMB Substrates market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
DBC Ceramic Substrates
AMB Ceramic Substrate

Market segment by Application
Automotive & EV/HEV
PV and Wind Power
Industrial Drives
Rail Transport
Consumer & White Goods
Military & Avionics
Thermoelectric Module (TEM)
Others

Major players covered
Rogers
NGK Electronics Devices
Heraeus Electronics
Jiangsu Fulehua Semiconductor Technology
Toshiba Materials
Denka
Proterial
Mitsubishi Materials
Kyocera
DOWA METALTECH
FJ Composite
KCC
Stellar Industries Corp
Littelfuse IXYS
Remtec
Shengda Tech
Nanjing Zhongjiang New Material Science & Technology
BYD
Zibo Linzi Yinhe High-Tech Development
Chengdu Wanshida Ceramic Industry
Zhejiang TC Ceramic Electronic
Tong Hsing (acquired HCS)
Fujian Huaqing Electronic Material Technology
Zhejiang Jingci Semiconductor
Konfoong Materials International
Taotao Technology
Anhui Taoxinke Semiconductor
Guangde Dongfeng Semiconductor
Beijing Moshi Technology
Nantong Winspower
Wuxi Tianyang Electronics

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Power Electronic DCB & AMB Substrates product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Power Electronic DCB & AMB Substrates, with price, sales quantity, revenue, and global market share of Power Electronic DCB & AMB Substrates from 2019 to 2024.

Chapter 3, the Power Electronic DCB & AMB Substrates competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Power Electronic DCB & AMB Substrates breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Power Electronic DCB & AMB Substrates market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Power Electronic DCB & AMB Substrates.

Chapter 14 and 15, to describe Power Electronic DCB & AMB Substrates sales channel, distributors, customers, research findings and conclusion.