Global Planar Die Bonder Supply, Demand and Key Producers, 2023-2029

Global Planar Die Bonder Supply, Demand and Key Producers, 2023-2029

The global Planar Die Bonder market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).

A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.

This report studies the global Planar Die Bonder production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Planar Die Bonder, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Planar Die Bonder that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Planar Die Bonder total production and demand, 2018-2029, (Units)

Global Planar Die Bonder total production value, 2018-2029, (USD Million)

Global Planar Die Bonder production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (Units)

Global Planar Die Bonder consumption by region & country, CAGR, 2018-2029 & (Units)

U.S. VS China: Planar Die Bonder domestic production, consumption, key domestic manufacturers and share

Global Planar Die Bonder production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (Units)

Global Planar Die Bonder production by Type, production, value, CAGR, 2018-2029, (USD Million) & (Units)

Global Planar Die Bonder production by Application production, value, CAGR, 2018-2029, (USD Million) & (Units).

This reports profiles key players in the global Planar Die Bonder market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include ASM Pacific Technology Ltd., Kulicke & Soffa Industries, Inc., Tokyo Electron Limited, Applied Materials, Inc., Disco Corporation, EV Group (EVG), SPTS Technologies Ltd., Besi (BE Semiconductor Industries N.V.) and Nordson Corporation, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Planar Die Bonder market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Units) and average price (US$/Unit) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Planar Die Bonder Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Planar Die Bonder Market, Segmentation by Type
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder

Global Planar Die Bonder Market, Segmentation by Application
Semiconductor Manufacturing
Electronic Packaging
Others

Companies Profiled:
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation

Key Questions Answered

1. How big is the global Planar Die Bonder market?

2. What is the demand of the global Planar Die Bonder market?

3. What is the year over year growth of the global Planar Die Bonder market?

4. What is the production and production value of the global Planar Die Bonder market?

5. Who are the key producers in the global Planar Die Bonder market?

6. What are the growth factors driving the market demand?