Global PCB Plating Equipment Market 2025 by Company, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global PCB Plating Equipment market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.

In the printed circuit board, copper is used to interconnect components on a substrate , although it is to form a conductive path printed circuit board graphics board good conductor material , but if prolonged exposure to air , but also it is easy to lose luster due to oxidation , corrosion and loss suffered due weldability . Therefore, you must use a variety of techniques to protect the copper traces , vias , and plated through holes , such techniques include the organic coating, the oxide film and plating techniques .

Metal plating or coating process is to ensure weldability and corrosion protection circuit to avoid the standard operation, the circuit board manufacturing plays an important role in the single-sided , double-sided and multilayer printed . In particular, the plating layer having a printed line of the weld metal has become a solder protective layer provided for the operation of a standard copper tracks .

Development occurs in electroplating , through the development of automated computer -controlled plating equipment , conduct chemical analysis of organic and metallic additives in highly complex instrument technology, and precise control of the chemical reaction process technology, electroplating technology to achieve a high level.

According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.

This report is a detailed and comprehensive analysis for global PCB Plating Equipment market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global PCB Plating Equipment market size and forecasts, in consumption value ($ Million), 2020-2031

Global PCB Plating Equipment market size and forecasts by region and country, in consumption value ($ Million), 2020-2031

Global PCB Plating Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031

Global PCB Plating Equipment market shares of main players, in revenue ($ Million), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for PCB Plating Equipment

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global PCB Plating Equipment market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Atotech, EEJA, Dongguan UCE Group, Kunshan Dongwei Technology, George Koch Sons, PAT, PAL, Commend Machinery, AEL, TKC Co., Ltd, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

PCB Plating Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
VCP
Vertical Lift Plating Equipment
Horizontal Plating Equipment

Market segment by Application
Flexible Board
Rigid Board
Rigid-flex Board

Market segment by players, this report covers
Atotech
EEJA
Dongguan UCE Group
Kunshan Dongwei Technology
George Koch Sons
PAT
PAL
Commend Machinery
AEL
TKC Co., Ltd
Jastech
KOVOFINIS
JCU
Technic Inc
Besi
Gangmu Machinery

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe PCB Plating Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of PCB Plating Equipment, with revenue, gross margin, and global market share of PCB Plating Equipment from 2020 to 2025.

Chapter 3, the PCB Plating Equipment competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and PCB Plating Equipment market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of PCB Plating Equipment.

Chapter 13, to describe PCB Plating Equipment research findings and conclusion.