Global PCB Hard Substrate Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global PCB Hard Substrate Material Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

PCB hard substrate materials refer to substrate materials used to manufacture PCBs, including BT resin, ABF materials, MIS materials, etc. Different hard substrate materials are suitable for different application scenarios and requirements. Choosing the appropriate substrate material can improve the performance and reliability of PCB.

According to our (Global Info Research) latest study, the global PCB Hard Substrate Material market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %during review period.

This report is a detailed and comprehensive analysis for global PCB Hard Substrate Material market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global PCB Hard Substrate Material market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2019-2030

Global PCB Hard Substrate Material market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2019-2030

Global PCB Hard Substrate Material market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (US$/Ton), 2019-2030

Global PCB Hard Substrate Material market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (US$/Ton), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for PCB Hard Substrate Material

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global PCB Hard Substrate Material market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsubishi Chemical, Nan Ya Plastics Corporation, Unimicron Technology, Hitachi, Isola Group, Unimicron Technology Corp, Nan Ya Printed Circuit Board Corporation, AT&S, Samsung Electro-Mechanics (SEMCO), Kyocera, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

PCB Hard Substrate Material market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
BT Resin
ABF Material
MIS Material
Others

Market segment by Application
Electronics
Automotive
Aerospace
Others

Major players covered
Mitsubishi Chemical
Nan Ya Plastics Corporation
Unimicron Technology
Hitachi
Isola Group
Unimicron Technology Corp
Nan Ya Printed Circuit Board Corporation
AT&S
Samsung Electro-Mechanics (SEMCO)
Kyocera
TOPPAN
ASE Material
LG Innotek
Shennan Circuit
JCET Group
WaferChem Technology
Qinyang Tianyi Chemical
Suzhou HengKang New Materials
Tianjin Boyuan New Materials

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe PCB Hard Substrate Material product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of PCB Hard Substrate Material, with price, sales quantity, revenue, and global market share of PCB Hard Substrate Material from 2019 to 2024.

Chapter 3, the PCB Hard Substrate Material competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the PCB Hard Substrate Material breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and PCB Hard Substrate Material market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of PCB Hard Substrate Material.

Chapter 14 and 15, to describe PCB Hard Substrate Material sales channel, distributors, customers, research findings and conclusion.