Global Multilayer Printed-wiring Board Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Multilayer Printed-wiring Board Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper foil layer is bonded together by PP(prepreg), Multilayer PCB is one of the most complex types in printed circuit board.

According to our (Global Info Research) latest study, the global Multilayer Printed-wiring Board market size was valued at US$ 31320 million in 2023 and is forecast to a readjusted size of USD 38250 million by 2030 with a CAGR of 2.9% during review period.

Global Multilayer Printed-wiring Board main players include Tripod, Nippon Mektron, Zhen Ding Technology, Unimicron, Shennan, TPT, etc., totally accounting for about 11% of market. China is the largest market of Multilayer Printed-wiring Board, with a share over 60%. As for the types of products, it can be divided into Layer 4-6, Layer 8-10 and Layer 10+. The most common product is Layer 4-6, with a share over 64%. In terms of applications, it is widely used in consumer electronics, communications, computer related industry, automotive industry and others. The most application is communications, with a share over 31%.

This report is a detailed and comprehensive analysis for global Multilayer Printed-wiring Board market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Multilayer Printed-wiring Board market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (USD/Sqm), 2019-2030

Global Multilayer Printed-wiring Board market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (USD/Sqm), 2019-2030

Global Multilayer Printed-wiring Board market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (USD/Sqm), 2019-2030

Global Multilayer Printed-wiring Board market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (USD/Sqm), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Multilayer Printed-wiring Board

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Multilayer Printed-wiring Board market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Nippon Mektron, Zhen Ding Technology, Unimicron, Young Poong Group, SEMCO, Ibiden, Tripod, TTM Technologies, Sumitomo Electric SEI, Daeduck Group, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Multilayer Printed-wiring Board market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Layer 4-6
Layer 8-10
Layer 10+

Market segment by Application
Consumer Electronics
Communications
Computer Related Industry
Automotive Industry
Others

Major players covered
Nippon Mektron
Zhen Ding Technology
Unimicron
Young Poong Group
SEMCO
Ibiden
Tripod
TTM Technologies
Sumitomo Electric SEI
Daeduck Group
Nan Ya PCB
Compeq
HannStar Board
LG Innotek
AT&S
Meiko
WUS
TPT
Chin-Poon
Shennan

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Multilayer Printed-wiring Board product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Multilayer Printed-wiring Board, with price, sales quantity, revenue, and global market share of Multilayer Printed-wiring Board from 2019 to 2024.

Chapter 3, the Multilayer Printed-wiring Board competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Multilayer Printed-wiring Board breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Multilayer Printed-wiring Board market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Multilayer Printed-wiring Board.

Chapter 14 and 15, to describe Multilayer Printed-wiring Board sales channel, distributors, customers, research findings and conclusion.