According to our (Global Info Research) latest study, the global Mobile Device Substrate-Like PCBs market size was valued at US$ 888 million in 2024 and is forecast to a readjusted size of USD 1552 million by 2031 with a CAGR of 8.4% during review period.
This report is a detailed and comprehensive analysis for global Mobile Device Substrate-Like PCBs market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Mobile Device Substrate-Like PCBs market size and forecasts, in consumption value ($ Million), sales quantity (square meters), and average selling prices (USD/square meter), 2020-2031
Global Mobile Device Substrate-Like PCBs market size and forecasts by region and country, in consumption value ($ Million), sales quantity (square meters), and average selling prices (USD/square meter), 2020-2031
Global Mobile Device Substrate-Like PCBs market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (square meters), and average selling prices (USD/square meter), 2020-2031
Global Mobile Device Substrate-Like PCBs market shares of main players, shipments in revenue ($ Million), sales quantity (square meters), and ASP (USD/square meter), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Mobile Device Substrate-Like PCBs
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Mobile Device Substrate-Like PCBs market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AT&S, Samsung Electro-Mechanics, Korea Circuit, Daeduck, ISU Petasys, Tripod Technology Corporation, Ibiden, LG Innotek, Kinsus Interconnect Technology, Zhen Ding Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Mobile Device Substrate-Like PCBs market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
25/25µm and 30/30µm Line/Space
Less Than 25/25 µm Line/Space
Market segment by Application
Smart Phone
Smart Watch
Major players covered
AT&S
Samsung Electro-Mechanics
Korea Circuit
Daeduck
ISU Petasys
Tripod Technology Corporation
Ibiden
LG Innotek
Kinsus Interconnect Technology
Zhen Ding Technology
TTM Technologies
Unimicron
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Mobile Device Substrate-Like PCBs product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Mobile Device Substrate-Like PCBs, with price, sales quantity, revenue, and global market share of Mobile Device Substrate-Like PCBs from 2020 to 2025.
Chapter 3, the Mobile Device Substrate-Like PCBs competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Mobile Device Substrate-Like PCBs breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Mobile Device Substrate-Like PCBs market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Mobile Device Substrate-Like PCBs.
Chapter 14 and 15, to describe Mobile Device Substrate-Like PCBs sales channel, distributors, customers, research findings and conclusion.
Learn how to effectively navigate the market research process to help guide your organization on the journey to success.
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