Global Metal Shell for Microelectronic Packages Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Metal Shell for Microelectronic Packages Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity, electromagnetic shielding function and convenient machining. Metal packaging refers to the metal as the main material of the tube shell, directly or indirectly through the substrate to install the chip on the tube seat, with a lead wire connected to the internal and external circuit of an electronic packaging form. It is widely used in the packaging of hybrid circuits, mainly for military, civil and customized special airtight packaging, among which, it has been widely used in the military and aerospace fields. The various forms of metal packaging and flexible processing can be integrated with some components (such as hybrid integrated A/D or D/A converters), suitable for low I/O single chip and multi-chip applications, RF, microwave, optoelectronic, surface acoustic wave and high power devices, can meet the requirements of small batch, high reliability. In addition, in order to solve the problem of packaging heat dissipation, all kinds of packaging also mostly use metal as heat sink and heat sink.

Traditional metal materials include: Cu, Al, Kovar alloy (Fe-Ni-Co alloy), Invar alloy (Ni-Fe alloy), W, Mo alloy and so on.

Most metal packages are physical packages. Metal packaging materials in order to achieve the total piece support, electrical connection, heat dissipation, mechanical and environmental protection, usually have the following requirements; ① has good heat conduction and heat dissipation; ② good conductivity, reduce transmission delay and energy loss and sweep; (3) light weight, at the same time requires sufficient strength and mechanical properties; ④ Good processing capacity for mass production; (5) Low thermal expansion coefficient, in order to meet the match with the chip, thereby reducing the generation of thermal stress; Good welding performance, coating performance and corrosion resistance to achieve reliable combination with the chip, sealing and environmental protection.

According to our (Global Info Research) latest study, the global Metal Shell for Microelectronic Packages market size was valued at US$ 2050 million in 2023 and is forecast to a readjusted size of USD 2036 million by 2030 with a CAGR of -0.1% during review period.

In terms of market sales, China accounts for 22% of global market share.

In terms of suppliers, the world"s leading manufacturers of metal packaging and shell include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, Kairui, Jiangsu Dongcheng Micro-electronics, Taizhou Hangyu Electric Appliance, CETC40, Bojing Electronics, CETC43, SINOPIONEER, CCTC, Xingchuang, Rizhao Xunsun Electronics and Shengda Technology. The top five together account for 40% of the market.

In the consumer application market, the main application fields are concentrated in aerospace, petrochemical industry, automobile, optical communication and other fields. Among them, optical communication is the largest application field, with more than 31% of the metal shells used for packaging concentrated in optical communication.

This report is a detailed and comprehensive analysis for global Metal Shell for Microelectronic Packages market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Metal Shell for Microelectronic Packages market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2019-2030

Global Metal Shell for Microelectronic Packages market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2019-2030

Global Metal Shell for Microelectronic Packages market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2019-2030

Global Metal Shell for Microelectronic Packages market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (USD/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Metal Shell for Microelectronic Packages

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Metal Shell for Microelectronic Packages market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AMETEK(GSP), SCHOTT, Complete Hermetics, KOTO, Kyocera, SGA Technologies, Century Seals, KaiRui, Jiangsu Dongguang Micro-electronics, Taizhou Hangyu Electric Appliance, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Metal Shell for Microelectronic Packages market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
TO Shell
Flat Shell

Market segment by Application
Aeronautics and Astronautics
Petrochemical Industry
Automobile
Optical Communication
Other

Major players covered
AMETEK(GSP)
SCHOTT
Complete Hermetics
KOTO
Kyocera
SGA Technologies
Century Seals
KaiRui
Jiangsu Dongguang Micro-electronics
Taizhou Hangyu Electric Appliance
CETC40
BOJING ELECTRONICS
CETC43
SINOPIONEER
CCTC
XingChuang
Rizhao Xuri Electronics Co., Ltd.
ShengDa Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Metal Shell for Microelectronic Packages product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Metal Shell for Microelectronic Packages, with price, sales quantity, revenue, and global market share of Metal Shell for Microelectronic Packages from 2019 to 2024.

Chapter 3, the Metal Shell for Microelectronic Packages competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Metal Shell for Microelectronic Packages breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Metal Shell for Microelectronic Packages market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Metal Shell for Microelectronic Packages.

Chapter 14 and 15, to describe Metal Shell for Microelectronic Packages sales channel, distributors, customers, research findings and conclusion.