Global Low Temperature Solder Pastes Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Low Temperature Solder Pastes Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Solder paste, a unique combination of minute metal solder particle and slimy flux, is exclusively known for its usage in the printed circuit board or PCB manufacturing. This special paste attaches the mount particles to pads on the board and creates a stable bond between two different work elements. In this process, the sizes of the metal particles and the density of the flux play a significant role and decide the outcome of the solder paste.

Low-temperature solder paste, is a very extraordinary blend of tiny metal particles and sticky flux. This easily dissolves even at a temperature under 180° C. Usually, the typical solder paste temperature extends over 250° C to 240° C, which often becomes destructive for some delicate particles.

A solder paste having a melting point of 138 ° C is called a low-temperature solder paste.

According to our (Global Info Research) latest study, the global Low Temperature Solder Pastes market size was valued at US$ 318 million in 2023 and is forecast to a readjusted size of USD 445 million by 2030 with a CAGR of 5.0% during review period.

Alpha and Senju are the top 2 manufacturers of global low temperature solder pastes industry and holds about 35% of global market share. Geographically speaking, Asia-Pacific is the largest market with over 65% market share. In terms of type, silver-free segement is holds about 80% of total market share. In terms of application, stencil printing holds an important share of about 60%.

This report is a detailed and comprehensive analysis for global Low Temperature Solder Pastes market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Low Temperature Solder Pastes market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (K USD/Ton), 2019-2030

Global Low Temperature Solder Pastes market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (K USD/Ton), 2019-2030

Global Low Temperature Solder Pastes market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (K USD/Ton), 2019-2030

Global Low Temperature Solder Pastes market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (K USD/Ton), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Low Temperature Solder Pastes

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Low Temperature Solder Pastes market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Alpha, Senju, Vital New Material, Indium Corporation, Genma, Tamura, Qualitek, AIM, Henkel, Inventec, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Low Temperature Solder Pastes market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Silver Contained
Silver-free

Market segment by Application
Solder Dispensing
Stencil Printing

Major players covered
Alpha
Senju
Vital New Material
Indium Corporation
Genma
Tamura
Qualitek
AIM
Henkel
Inventec
Shenmao
Tongfang Tech
KOKI
Superior Flux
Nihon Superior

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Low Temperature Solder Pastes product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Low Temperature Solder Pastes, with price, sales quantity, revenue, and global market share of Low Temperature Solder Pastes from 2019 to 2024.

Chapter 3, the Low Temperature Solder Pastes competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Low Temperature Solder Pastes breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Low Temperature Solder Pastes market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Low Temperature Solder Pastes.

Chapter 14 and 15, to describe Low Temperature Solder Pastes sales channel, distributors, customers, research findings and conclusion.