Global Low Pressure Molding Hot Melt Adhesive Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Low Pressure Molding Hot Melt Adhesive Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

The low-pressure injection molding process is a packaging process that uses very low injection pressure to inject hot-melt adhesive material into the mold and quickly solidifies it (the speed only takes 1-50 seconds). It uses hot-melt adhesive as the material and has excellent sealing properties. And excellent physical properties, product performance achieves insulation, temperature resistance, impact resistance, shock absorption, moisture-proof, waterproof, dust-proof, chemical corrosion resistance and other functions.

This process is currently mainly used in the packaging and protection of precision and sensitive electronic components, including: printed circuit boards (PCBs), automotive electronics, mobile phone batteries, wiring harnesses, waterproof connectors, sensors, micro switches, inductors, and antennas etc.

Low-pressure injection molding plays a good role in protecting electronic components. The traditional injection molding process has defects due to excessive pressure. Because low-pressure molding requires only a small pressure to make the melt flow into a small mold space, it will not damage the fragile components that need to be packaged, greatly reducing the cost. The low-pressure injection molding process is not only environmentally friendly, but also greatly improves production efficiency and can help reduce the total production cost.

Low pressure injection molding hot melt adhesive. This material is able to reach small areas without high pressure, making it ideal for sensitive components. The adhesive properties of polyamide provide optimal bonding and effectively seal against moisture and other environmental contaminants. The high chemical resistance of low-pressure molding hot melt adhesives represented by polyamide to oil, diesel, grease and weak acids also improves the performance of the finished product.

According to our (Global Info Research) latest study, the global Low Pressure Molding Hot Melt Adhesive market size was valued at US$ 253 million in 2023 and is forecast to a readjusted size of USD 399 million by 2030 with a CAGR of 6.8% during review period.

The global key manufacturers of low pressure molding hot melt adhesives are Henkel, Bostik and Huntsman. The top two manufacturers have a market share of about 70%. Global origins are mainly in North America, Europe and China, with Europe being the largest production region, holding more than 40% of the market share. By far, polyamide is the largest product segment, with a market share of around 90%. Meanwhile, in terms of applications, consumer electronics is the largest application, with about 65% of the market share.

This report is a detailed and comprehensive analysis for global Low Pressure Molding Hot Melt Adhesive market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Low Pressure Molding Hot Melt Adhesive market size and forecasts, in consumption value ($ Million), sales quantity (Tons), and average selling prices (K USD/Ton), 2019-2030

Global Low Pressure Molding Hot Melt Adhesive market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Tons), and average selling prices (K USD/Ton), 2019-2030

Global Low Pressure Molding Hot Melt Adhesive market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Tons), and average selling prices (K USD/Ton), 2019-2030

Global Low Pressure Molding Hot Melt Adhesive market shares of main players, shipments in revenue ($ Million), sales quantity (Tons), and ASP (K USD/Ton), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Low Pressure Molding Hot Melt Adhesive

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Low Pressure Molding Hot Melt Adhesive market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, Bostik, Huntsman, SUNTIP, Austromelt, Bühnen, KY Chemical, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Low Pressure Molding Hot Melt Adhesive market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Polyamide
Polyolefin
Others

Market segment by Application
Consumer Electronics
Automotive
Medical Devices
Others

Major players covered
Henkel
Bostik
Huntsman
SUNTIP
Austromelt
Bühnen
KY Chemical

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Low Pressure Molding Hot Melt Adhesive product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Low Pressure Molding Hot Melt Adhesive, with price, sales quantity, revenue, and global market share of Low Pressure Molding Hot Melt Adhesive from 2019 to 2024.

Chapter 3, the Low Pressure Molding Hot Melt Adhesive competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Low Pressure Molding Hot Melt Adhesive breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Low Pressure Molding Hot Melt Adhesive market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Low Pressure Molding Hot Melt Adhesive.

Chapter 14 and 15, to describe Low Pressure Molding Hot Melt Adhesive sales channel, distributors, customers, research findings and conclusion.