Global Liquid and Dry Film Resists for Advanced Packaging Supply, Demand and Key Producers, 2023-2029

Global Liquid and Dry Film Resists for Advanced Packaging Supply, Demand and Key Producers, 2023-2029

The global Liquid and Dry Film Resists for Advanced Packaging market size is expected to reach $ 201 million by 2029, rising at a market growth of 5.5% CAGR during the forecast period (2023-2029).

In terms of product type, Thick Film Positive Photoresists accounting for 62% of the Photoresists for Advanced IC Packaging. And in terms of application, currently Thick Film Positive Photoresists are mainly used in semiconductor advanced packaging process, Wafer-Level Packaging and Flip Chip (FC) packaging, among them Flip Chip (FC) packaging is the largest application, with a share over 50%. Currently the Photoresists for Advanced IC Packaging are mainly produced in Japan, US, and Europe. Japan is the largest producer of thick layer photoresists, occupied over 55 percent, followed by Europe and North America. The global major manufacturers of Photoresists for Advanced IC Packaging include JSR, TOKYO OHKA KOGYO CO., LTD. (TOK), DuPont, and Merck KGaA (AZ), etc. In terms of revenue, the global 3 largest players have a market share over 80%.

This report studies the global Liquid and Dry Film Resists for Advanced Packaging production, demand, key manufacturers, and key regions.

This report is a detailed and comprehensive analysis of the world market for Liquid and Dry Film Resists for Advanced Packaging, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Liquid and Dry Film Resists for Advanced Packaging that contribute to its increasing demand across many markets.

Highlights and key features of the study

Global Liquid and Dry Film Resists for Advanced Packaging total production and demand, 2018-2029, (Tons)

Global Liquid and Dry Film Resists for Advanced Packaging total production value, 2018-2029, (USD Million)

Global Liquid and Dry Film Resists for Advanced Packaging production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (Tons)

Global Liquid and Dry Film Resists for Advanced Packaging consumption by region & country, CAGR, 2018-2029 & (Tons)

U.S. VS China: Liquid and Dry Film Resists for Advanced Packaging domestic production, consumption, key domestic manufacturers and share

Global Liquid and Dry Film Resists for Advanced Packaging production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (Tons)

Global Liquid and Dry Film Resists for Advanced Packaging production by Type, production, value, CAGR, 2018-2029, (USD Million) & (Tons)

Global Liquid and Dry Film Resists for Advanced Packaging production by Application production, value, CAGR, 2018-2029, (USD Million) & (Tons).

This reports profiles key players in the global Liquid and Dry Film Resists for Advanced Packaging market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include JSR, Tokyo Ohka Kogyo (TOK), Merck KGaA (AZ), DuPont, Shin-Etsu, Allresist, Futurrex, KemLab™ Inc and Youngchang Chemical, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Liquid and Dry Film Resists for Advanced Packaging market.

Detailed Segmentation:

Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (Tons) and average price (US$/Ton) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.

Global Liquid and Dry Film Resists for Advanced Packaging Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World

Global Liquid and Dry Film Resists for Advanced Packaging Market, Segmentation by Type
Liquid Photoresists
Dry Film Photoresists

Global Liquid and Dry Film Resists for Advanced Packaging Market, Segmentation by Application
WLCSP
MEMS
3D Packaging

Companies Profiled:
JSR
Tokyo Ohka Kogyo (TOK)
Merck KGaA (AZ)
DuPont
Shin-Etsu
Allresist
Futurrex
KemLab™ Inc
Youngchang Chemical
Everlight Chemical
Crystal Clear Electronic Material
Kempur Microelectronics Inc
Xuzhou B & C Chemical
nepes
Shanghai Sinyang Semiconductor Materials
eChem Slolutions Japan
Fuyang Sineva Material Technology

Key Questions Answered

1. How big is the global Liquid and Dry Film Resists for Advanced Packaging market?

2. What is the demand of the global Liquid and Dry Film Resists for Advanced Packaging market?

3. What is the year over year growth of the global Liquid and Dry Film Resists for Advanced Packaging market?

4. What is the production and production value of the global Liquid and Dry Film Resists for Advanced Packaging market?

5. Who are the key producers in the global Liquid and Dry Film Resists for Advanced Packaging market?

6. What are the growth factors driving the market demand?