Global Lead Frame Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Lead Frame Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package mechanically. A lead frame consists of a die mounting paddle and lead fingers. The die paddle serves primarily to mechanically support the die during package manufacture. The lead fingers connect the die to the circuitry external to the package.

According to our (Global Info Research) latest study, the global Lead Frame market size was valued at US$ 4274 million in 2023 and is forecast to a readjusted size of USD 5486 million by 2030 with a CAGR of 3.7% during review period.

Global lead frame key manufacturers include Mitsui High-tec, Shinko, Chang Hua Technology Co. The top three manufacturers hold about 35% of the global share. Global origins are mainly located in China, Japan, Korea, Taiwan (China), and Southeast Asia, with China being the largest production region with a 27% share. In terms of process type, stamping process leadframes are the largest segment with about 74% share, while in terms of downstream, integrated circuit are the largest downstream segment with 60% share, followed by discrete devices.

This report is a detailed and comprehensive analysis for global Lead Frame market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Lead Frame market size and forecasts, in consumption value ($ Million), sales quantity (B Units), and average selling prices (USD/K Units), 2019-2030

Global Lead Frame market size and forecasts by region and country, in consumption value ($ Million), sales quantity (B Units), and average selling prices (USD/K Units), 2019-2030

Global Lead Frame market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (B Units), and average selling prices (USD/K Units), 2019-2030

Global Lead Frame market shares of main players, shipments in revenue ($ Million), sales quantity (B Units), and ASP (USD/K Units), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Lead Frame

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Lead Frame market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui High-tec, Shinko, Chang Wah Technology, Advanced Assembly Materials International, HAESUNG DS, SDI, Fusheng Electronics, Enomoto, Kangqiang, POSSEHL, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Lead Frame market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Stamping Process Leadframe
Etching Process Leadframe

Market segment by Application
Integrated Circuit
Discrete Device
Others

Major players covered
Mitsui High-tec
Shinko
Chang Wah Technology
Advanced Assembly Materials International
HAESUNG DS
SDI
Fusheng Electronics
Enomoto
Kangqiang
POSSEHL
JIH LIN TECHNOLOGY
Jentech
Hualong
Dynacraft Industries
QPL Limited
WUXI HUAJING LEADFRAME
HUAYANG ELECTRONIC
DNP
Xiamen Jsun Precision Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Lead Frame product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Lead Frame, with price, sales quantity, revenue, and global market share of Lead Frame from 2019 to 2024.

Chapter 3, the Lead Frame competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Lead Frame breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Lead Frame market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Lead Frame.

Chapter 14 and 15, to describe Lead Frame sales channel, distributors, customers, research findings and conclusion.