Global Laser Dicing Machine for Semiconductor Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Global Laser Dicing Machine for Semiconductor Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030

Wafer fabs continually face challenges in manufacturing semiconductor devices because the devices continue to get tinier and more complicated. Integrated circuits continue to increase in circuit density. Trends in chip design and materials, such as using die attach films and wafers as thin as 50 μm, add to the complexity of manufacturing. In fabrication processes, wafer dicing plays an early and critical role in the quality of the final product.

Silicon wafers thicker than 100 μm traditionally are cut by diamond blades or saws, and the blade’ s thickness, grit size, and rotating and cutting speeds affect the cutting quality. This technique has been refined over the years, yet it still causes problems that cannot be ignored. Chipping of the wafer occurs because of the force of the sawing process. The large cut width (kerf) caused by the blade wastes the wafer and produces debris that must be cleaned up. Other issues include wearing down of the blade over time and the cost of blade replacement.

For silicon wafers less than 100 μm thick, laser ablation offers an alternative to the blade technique, which is too powerful for the delicate thin wafers. However, laser ablation has its own problems. Vaporizing the wafer with a laser along the dicing path creates molten debris and microcracks. The debris deposited on the surface of the wafer is difficult to clean up, and the cracks result in chips with lower strength.

In contrast, stealth dicing does not generate the problems brought on by either the blade or laser ablation techniques. With stealth dicing, there is no chipping or debris, which eliminates the need for a cleanup process. It also reduces the amount of wasted wafer because of its very narrow dicing path, offering space on the wafer for more chips and higher production yield. Also, the technique does not cause heat damage because the laser cuts below the surface of the wafer; this contributes to rendering the chips more resistant to breakage.

According to our (Global Info Research) latest study, the global Laser Dicing Machine for Semiconductor market size was valued at US$ 342 million in 2023 and is forecast to a readjusted size of USD 453 million by 2030 with a CAGR of 4.2% during review period.

Global key manufacturers of Laser Dicing Machine for Semiconductor include DISCO, Wuxi Autowell, Suzhou Quick Laser Technology Co, Han's Laser Technology Co, DelphiLaser, etc. Global top five manufacturers hold a share about 51%. Asia-Pacific is the largest market of Laser Dicing Machine for Semiconductor, holds a share over 77%. And in terms of application, the largest application is Seal Testing, with a share of over 31%.

This report is a detailed and comprehensive analysis for global Laser Dicing Machine for Semiconductor market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Laser Dicing Machine for Semiconductor market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global Laser Dicing Machine for Semiconductor market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global Laser Dicing Machine for Semiconductor market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030

Global Laser Dicing Machine for Semiconductor market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Laser Dicing Machine for Semiconductor

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Laser Dicing Machine for Semiconductor market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO Corporation, Wuxi Autowell Technology Co, Han's Laser Technology Co, Wuhan Huagong Laser Engineering Co, Suzhou Delphi Laser Co, Tokyo Seimitsu, Suzhou Maxwell Technologies Co, Suzhou Quick Laser Technology Co, EO Technics, Synova S.A., etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Laser Dicing Machine for Semiconductor market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Traditional Dicing
Stealth Dicing

Market segment by Application
Foundry
IDM
Seal Testing
PV Industry
Others

Major players covered
DISCO Corporation
Wuxi Autowell Technology Co
Han's Laser Technology Co
Wuhan Huagong Laser Engineering Co
Suzhou Delphi Laser Co
Tokyo Seimitsu
Suzhou Maxwell Technologies Co
Suzhou Quick Laser Technology Co
EO Technics
Synova S.A.
Shenzhen Guangyuan Intelligent Equipment Co
China Electronics Technology Group Corporation
3D-Micromac AG
Genesem
ASMPT
GIE
Suzhou Lumi Laser Technology Co
Corning

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Laser Dicing Machine for Semiconductor product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Laser Dicing Machine for Semiconductor, with price, sales quantity, revenue, and global market share of Laser Dicing Machine for Semiconductor from 2019 to 2024.

Chapter 3, the Laser Dicing Machine for Semiconductor competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Laser Dicing Machine for Semiconductor breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Laser Dicing Machine for Semiconductor market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Laser Dicing Machine for Semiconductor.

Chapter 14 and 15, to describe Laser Dicing Machine for Semiconductor sales channel, distributors, customers, research findings and conclusion.