Global Laser Annealing Equipment Market 2024 by Manufacturers, Regions, Type and Application, Forecast to 2030
Laser annealing equipment refers to a special equipment that uses high-energy laser beams to automatically anneal wafers. Its main function is to project a laser beam spot with a specific shape and uniform energy distribution onto a semiconductor wafer, which is carried and absorbed by a motion table for scanning , In order to complete the annealing process of the entire wafer.
According to our (Global Info Research) latest study, the global Laser Annealing Equipment market size was valued at US$ 1254 million in 2023 and is forecast to a readjusted size of USD 2461 million by 2030 with a CAGR of 10.2% during review period.
Global core laser annealing equipment manufacturers include Mitsui Group (JSW), Sumitomo Heavy Industries etc. The Top 1 companies hold a share about 35%. China Taiwan is the largest market, with a share about 30%, followed by South Korea and China with the share about 20% and 15%.In terms of product, power laser annealing equipment is the largest segment, with a share over 60%. And in terms of application, the largest application is power semiconductor, followed by advanced process chip.
This report is a detailed and comprehensive analysis for global Laser Annealing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Laser Annealing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030
Global Laser Annealing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030
Global Laser Annealing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2019-2030
Global Laser Annealing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Laser Annealing Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Laser Annealing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Veeco, Applied Materials, Hitachi, YAC BEAM, EO Technics, Beijing U-PRECISION Tech, Shanghai Micro Electronics Equipment, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
Market Segmentation
Laser Annealing Equipment market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Power Laser Annealing Equipment
IC front-end Laser Annealing Equipment
Market segment by Application
Power Semiconductor
Advanced Process Chip
Major players covered
Mitsui Group (JSW)
Sumitomo Heavy Industries
SCREEN Semiconductor Solutions
Veeco
Applied Materials
Hitachi
YAC BEAM
EO Technics
Beijing U-PRECISION Tech
Shanghai Micro Electronics Equipment
Chengdu Laipu Technology
Hans DSI
Market segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Laser Annealing Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Laser Annealing Equipment, with price, sales quantity, revenue, and global market share of Laser Annealing Equipment from 2019 to 2024.
Chapter 3, the Laser Annealing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Laser Annealing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2019 to 2024.and Laser Annealing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Laser Annealing Equipment.
Chapter 14 and 15, to describe Laser Annealing Equipment sales channel, distributors, customers, research findings and conclusion.