Global IO-Link Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Global IO-Link Market 2024 by Company, Regions, Type and Application, Forecast to 2030

IO-Link is a short distance, bi-directional, digital, point-to-point, wired (or wireless), industrial communications networking standard (IEC 61131-9) used for connecting digital sensors and actuators to either a type of industrial fieldbus or a type of industrial Ethernet. Its objective is to provide a technological platform that enables the development and use of sensors and actuators that can produce and consume enriched sets of data that in turn can be used for economically optimizing industrial automated processes and operations. An IO-Link system consists of an IO-Link master and one or more IO-Link devices, i.e. Sensors or Actuators. The IO-Link master provides the interface to the higher-level controller (PLC) and controls the communication with the connected IO-Link devices.

According to our (Global Info Research) latest study, the global IO-Link market size was valued at US$ 2956 million in 2023 and is forecast to a readjusted size of USD 6564 million by 2030 with a CAGR of 12.2% during review period.

Global IO-Link key players include SICK, Siemens, Murrelektronik, ifm Electronic, Beckhoff, etc. Global top five manufacturers hold a share about 23%. Europe is the largest market, with a share about 36%, followed by North America and Asia Pacific, both have a share about 51 percent. In terms of product, IO-Link Master is the largest segment, with a share over 40%. And in terms of application, the largest application is Machine Tool & Assembly Line, followed by Intralogistics, etc.

This report is a detailed and comprehensive analysis for global IO-Link market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global IO-Link market size and forecasts, in consumption value ($ Million), 2019-2030

Global IO-Link market size and forecasts by region and country, in consumption value ($ Million), 2019-2030

Global IO-Link market size and forecasts, by Type and by Application, in consumption value ($ Million), 2019-2030

Global IO-Link market shares of main players, in revenue ($ Million), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for IO-Link

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global IO-Link market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include SICK, Siemens, Murrelektronik, ifm Electronic, Rockwel Automation, Beckhoff, Baumer Group, Turck, WAGO, Belden, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

IO-Link market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segmentation

IO-Link market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
IO-Link Master
IO-Link Sensor
Others

Market segment by Application
Machine Tool & Assembly Line
Intralogistics
Packaging
Others

Market segment by players, this report covers
SICK
Siemens
Murrelektronik
ifm Electronic
Rockwel Automation
Beckhoff
Baumer Group
Turck
WAGO
Belden
Bosch Rexforth
Pepperl+Fuchs
Balluff
Wenglor
Weidmüller
Omron

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe IO-Link product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of IO-Link, with revenue, gross margin, and global market share of IO-Link from 2019 to 2024.

Chapter 3, the IO-Link competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and IO-Link market forecast, by regions, by Type and by Application, with consumption value, from 2024 to 2030.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of IO-Link.

Chapter 13, to describe IO-Link research findings and conclusion.