Global IC Substrate Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

Global IC Substrate Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global IC Substrate market size was valued at US$ 14040 million in 2024 and is forecast to a readjusted size of USD 25020 million by 2031 with a CAGR of 8.7% during review period.

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging.

The main IC substrate players include Ibiden, Unimicron, Semco, Simmtech, Kinsus, etc. The top 5 players account for approximately 45% of the total global market. Asia-Pacific is the largest consumer market accounting for about 87%, followed by Europe and North America. In terms of type, FC-BGA is the largest segment, with a share about 30%. And in terms of application, the largest application is smart phones, followed by PC (tablet, laptop).

This report is a detailed and comprehensive analysis for global IC Substrate market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global IC Substrate market size and forecasts, in consumption value ($ Million), sales quantity (K Sq. m), and average selling prices (US$/Sq. m), 2020-2031

Global IC Substrate market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sq. m), and average selling prices (US$/Sq. m), 2020-2031

Global IC Substrate market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sq. m), and average selling prices (US$/Sq. m), 2020-2031

Global IC Substrate market shares of main players, shipments in revenue ($ Million), sales quantity (K Sq. m), and ASP (US$/Sq. m), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for IC Substrate

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global IC Substrate market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

IC Substrate market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type

WB CSP

FC BGA

FC CSP

PBGA

SiP

BOC

Other

Market segment by Application

Smart Phones

PC (Tablet, Laptop)

Wearable Devices

Others

Major players covered

Unimicron

Ibiden

Nan Ya PCB

Shinko Electric Industries

Kinsus Interconnect Technology

AT&S

Semco

Kyocera

TOPPAN

Zhen Ding Technology

Daeduck Electronics

ASE Material

LG InnoTek

Simmtech

Shennan Circuit

Shenzhen Fastprint Circuit Tech

ACCESS

Suntak Technology

National Center for Advanced Packaging (NCAP China)

Huizhou China Eagle Electronic Technology

DSBJ

Shenzhen Kinwong Electronic

AKM Meadville

Victory Giant Technology

KCC (Korea Circuit Company)

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe IC Substrate product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of IC Substrate, with price, sales quantity, revenue, and global market share of IC Substrate from 2020 to 2025.

Chapter 3, the IC Substrate competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the IC Substrate breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and IC Substrate market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of IC Substrate.

Chapter 14 and 15, to describe IC Substrate sales channel, distributors, customers, research findings and conclusion.