Global IC Package Substrates Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global IC Package Substrates market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of %during review period.

IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate can protect the circuit, special line, it is designed for heat dissipation and acts standardized module of IC components. It is one of the most key materials of the IC packaging, and the share of IC substrate for IC packaging is as high as 35-55%.

The major manufacturers that provide IC Package Substrates in China include SCC, Nanya and Access Substrates, etc. The top three manufacturers account for more than 50% of the market share. Among them, WB BGA and FC-CSP accounted for 39% and 38%, respectively. Smartphones and PCs (tablets and laptops) are the most widely used, accounting for 64% and 23%, respectively.

This report is a detailed and comprehensive analysis for global IC Package Substrates market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global IC Package Substrates market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031

Global IC Package Substrates market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031

Global IC Package Substrates market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/Sqm), 2020-2031

Global IC Package Substrates market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/Sqm), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for IC Package Substrates

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global IC Package Substrates market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

IC Package Substrates market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
FC-BGA
FC-CSP
WB BGA
WB CSP
RF Module
Others

Market segment by Application
Smart Phone
PC (tablet and Laptop)
Wearable Device
Others

Major players covered
Unimicron
Ibiden
Nan Ya PCB
Shinko Electric Industries
Kinsus Interconnect Technology
AT&S
Semco
Kyocera
TOPPAN
Zhen Ding Technology
Daeduck Electronics
ASE Material
LG InnoTek
Simmtech
Shennan Circuit
Shenzhen Fastprint Circuit Tech
ACCESS
Suntak Technology
National Center for Advanced Packaging (NCAP China)
Huizhou China Eagle Electronic Technology
DSBJ
Shenzhen Kinwong Electronic
AKM Meadville
Victory Giant Technology

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe IC Package Substrates product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of IC Package Substrates, with price, sales quantity, revenue, and global market share of IC Package Substrates from 2020 to 2025.

Chapter 3, the IC Package Substrates competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the IC Package Substrates breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and IC Package Substrates market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of IC Package Substrates.

Chapter 14 and 15, to describe IC Package Substrates sales channel, distributors, customers, research findings and conclusion.