Global Hot Melt Adhesives Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Hot Melt Adhesives market size was valued at US$ 8471 million in 2024 and is forecast to a readjusted size of USD 10620 million by 2031 with a CAGR of 3.3% during review period.

The hot melt adhesives are defined as adhesives that melt and flow on application of heat and solidify on cooling to give a strong adhesion. They are applied in a molten state at temperatures that range from 120°C to 180°C depending on applications and materials to be bonded.

Hot-melt adhesives are composed of three main components: a high-molecular-weight polymer that provides the adhesives’ main structure and mechanical properties, a resin/tackifier that provides wetting and adhesion properties, and a plasticizer (or wax) that controls viscosity. The defining component of the hot melt and the basis by which it is segmented is the polymer, the most commonly used being polyamides, polyesters, ethylene-vinyl acetates, polyurethanes, and various block copolymers.

At present, there are many manufacturers in every region and the major manufacturers’ activities of hot melt adhesives are Henkel, H. B. Fuller, Bostik Inc, 3M Company, Beardow & ADAMS, Jowat, Avery Dennison, DOW Corning and Kleiberit, etc.

This report is a detailed and comprehensive analysis for global Hot Melt Adhesives market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Hot Melt Adhesives market size and forecasts, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031

Global Hot Melt Adhesives market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031

Global Hot Melt Adhesives market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K MT), and average selling prices (USD/MT), 2020-2031

Global Hot Melt Adhesives market shares of main players, shipments in revenue ($ Million), sales quantity (K MT), and ASP (USD/MT), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Hot Melt Adhesives

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Hot Melt Adhesives market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, H. B. Fuller, Bostik(Arkema), 3M, Beardow Adams, Jowat, Avery Dennison, DOW Corning, Kleiberit, Sika AG, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Hot Melt Adhesives market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
EVA HMA
POE HMA
SBS HMA
SIS HMA
SEBS HMA
PU HMA
APAO HMA
Polyamide HMA
Polyimide HMA
Other

Market segment by Application
Paper Packaging
Bookbinding
Label & Tape
Hygiene
Transportation
Construction
Woodworking
Textile/Footwear
Others

Major players covered
Henkel
H. B. Fuller
Bostik(Arkema)
3M
Beardow Adams
Jowat
Avery Dennison
DOW Corning
Kleiberit
Sika AG
Tex Year Industries
Nanpao
Tianyang
Renhe
CherngTay Technology
Zhejiang Good
Huate

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Hot Melt Adhesives product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Hot Melt Adhesives, with price, sales quantity, revenue, and global market share of Hot Melt Adhesives from 2020 to 2025.

Chapter 3, the Hot Melt Adhesives competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Hot Melt Adhesives breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Hot Melt Adhesives market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Hot Melt Adhesives.

Chapter 14 and 15, to describe Hot Melt Adhesives sales channel, distributors, customers, research findings and conclusion.