Global High Thermal Conductivity Sintering Die Attach Adhesives Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Global High Thermal Conductivity Sintering Die Attach Adhesives Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global High Thermal Conductivity Sintering Die Attach Adhesives market size was valued at USD 169.8 million in 2022 and is forecast to a readjusted size of USD 232.5 million by 2029 with a CAGR of 4.6% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Silver Sintering Paste is a kind of high silver-filled die attach paste, which can achieve ultra-high thermal conductivity. Silver sintered pastes offer a robust lead-free alternative to solder pastes increasing the lifetime of the device up to 10 times. It can be applied to printing or dispensing processes, which can ensure higher thermal conductivity in lead frame and LED packaging applications.

This report is a detailed and comprehensive analysis for global High Thermal Conductivity Sintering Die Attach Adhesives market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.

Key Features:

Global High Thermal Conductivity Sintering Die Attach Adhesives market size and forecasts, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/g), 2018-2029

Global High Thermal Conductivity Sintering Die Attach Adhesives market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/g), 2018-2029

Global High Thermal Conductivity Sintering Die Attach Adhesives market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Kg), and average selling prices (US$/g), 2018-2029

Global High Thermal Conductivity Sintering Die Attach Adhesives market shares of main players, shipments in revenue ($ Million), sales quantity (Kg), and ASP (US$/g), 2018-2023

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for High Thermal Conductivity Sintering Die Attach Adhesives

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global High Thermal Conductivity Sintering Die Attach Adhesives market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Heraeus, Kyocera, Indium, Alpha Assembly Solutions and Henkel, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.

Market Segmentation

High Thermal Conductivity Sintering Die Attach Adhesives market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Pressure Sintering
Pressure-less Sintering

Market segment by Application
Power Semiconductor Device
RF Power Device
High Performance LED
Others

Major players covered
Heraeus
Kyocera
Indium
Alpha Assembly Solutions
Henkel
Namics
Advanced Joining Technology
Shenzhen Facemoore Technology
Beijing Nanotop Electronic Technology
TANAKA Precious Metals
Nihon Superior
Nihon Handa
NBE Tech
Solderwell Advanced Materials
Guangzhou Xianyi Electronic Technology
ShareX (Zhejiang) New Material Technology
Bando Chemical Industries

Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe High Thermal Conductivity Sintering Die Attach Adhesives product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of High Thermal Conductivity Sintering Die Attach Adhesives, with price, sales, revenue and global market share of High Thermal Conductivity Sintering Die Attach Adhesives from 2018 to 2023.

Chapter 3, the High Thermal Conductivity Sintering Die Attach Adhesives competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the High Thermal Conductivity Sintering Die Attach Adhesives breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and High Thermal Conductivity Sintering Die Attach Adhesives market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.

Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.

Chapter 13, the key raw materials and key suppliers, and industry chain of High Thermal Conductivity Sintering Die Attach Adhesives.

Chapter 14 and 15, to describe High Thermal Conductivity Sintering Die Attach Adhesives sales channel, distributors, customers, research findings and conclusion.