Global High Performance Plastic Parts for Semiconductor Equipment Market 2023 by Company, Regions, Type and Application, Forecast to 2029

Global High Performance Plastic Parts for Semiconductor Equipment Market 2023 by Company, Regions, Type and Application, Forecast to 2029

According to our (Global Info Research) latest study, the global High Performance Plastic Parts for Semiconductor Equipment market size was valued at USD 469.7 million in 2022 and is forecast to a readjusted size of USD 650.6 million by 2029 with a CAGR of 4.8% during review period.

This report studies high performance plastics for semiconductor equipment, typical products are wafer clamp rings, CMP retaining rings, Plasma Etching Shielding Parts, Wet Bench Wafer Holder, etc. Semiconductor fabrication equipment relies on a vast range of different components made of high performance plastics. Among other parts, wafer rings or more precisely wafer clamp rings are commonly used for supporting and accurately positioning the wafer throughout various processing operations. Clamping the wafer is critical for maintaining precise processing tolerances, thus maintaining wafer yields.

Semiconductor manufacturing equipment is a medium tool for achieving semiconductor manufacturing processes, playing an important role in all aspects. According to SEMI, worldwide sales of semiconductor manufacturing equipment increased 5% from $102.6 billion in 2021 to an all-time record of $107.6 billion in 2022.

In recent years, the localization process of China's semiconductor industry has further accelerated, and the performance of semiconductor equipment is more flexible than the overall industry. The localization of semiconductor equipment is ushering in a golden wave, and domestic semiconductor equipment is facing more opportunities for verification and trial use, technical cooperation, and import substitution. For the third consecutive year, China remained the largest semiconductor equipment market in 2022 despite a 5% slowdown in the pace of investments in the region year over year, accounting for $28.3 billion in billings.

The record high for semiconductor manufacturing equipment sales in 2022 stems from the industry’s drive to add the fab capacity required to support long-term growth and innovations in key end markets including high-performance computing and automotive. Additionally, the results reflect investments and determination across regions to avoid future semiconductor supply chain constraints like those that surfaced during the pandemic.

The Global Info Research report includes an overview of the development of the High Performance Plastic Parts for Semiconductor Equipment industry chain, the market status of Deposition (CVD, PVD, ALD) (PPS Parts, PEEK Parts), CMP (PPS Parts, PEEK Parts), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of High Performance Plastic Parts for Semiconductor Equipment.

Regionally, the report analyzes the High Performance Plastic Parts for Semiconductor Equipment markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global High Performance Plastic Parts for Semiconductor Equipment market, with robust domestic demand, supportive policies, and a strong manufacturing base.

Key Features:

The report presents comprehensive understanding of the High Performance Plastic Parts for Semiconductor Equipment market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the High Performance Plastic Parts for Semiconductor Equipment industry.

The report involves analyzing the market at a macro level:

Market Sizing and Segmentation: Report collect data on the overall market size, including the revenue generated, and market share of different by Type (e.g., PPS Parts, PEEK Parts).

Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the High Performance Plastic Parts for Semiconductor Equipment market.

Regional Analysis: The report involves examining the High Performance Plastic Parts for Semiconductor Equipment market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.

Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the High Performance Plastic Parts for Semiconductor Equipment market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.

The report also involves a more granular approach to High Performance Plastic Parts for Semiconductor Equipment:

Company Analysis: Report covers individual High Performance Plastic Parts for Semiconductor Equipment players, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.

Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards High Performance Plastic Parts for Semiconductor Equipment This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Deposition (CVD, PVD, ALD), CMP).

Technology Analysis: Report covers specific technologies relevant to High Performance Plastic Parts for Semiconductor Equipment. It assesses the current state, advancements, and potential future developments in High Performance Plastic Parts for Semiconductor Equipment areas.

Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the High Performance Plastic Parts for Semiconductor Equipment market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.

Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.

Market Segmentation

High Performance Plastic Parts for Semiconductor Equipment market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.

Market segment by Type
PPS Parts
PEEK Parts
PET Parts
PI (Polyimide/PAI) Parts
PEI (Polyetherimide) Parts
PC Parts
Others

Market segment by Application
Deposition (CVD, PVD, ALD)
CMP
Etching
Cleaning Equipment
Others

Market segment by players, this report covers
Mitsubishi Chemical
Victrex
Solvay
Willbe S&T
CALITECH
Cnus Co., Ltd.
UIS Technologies
Euroshore
PTC, Inc.
AKT Components Sdn Bhd
Ensinger
Shen-Yueh Technology
21st Century Co., Ltd.
CDI Products
Victrex
PBI Performance Products, Inc.

Market segment by regions, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, UK, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)
South America (Brazil, Argentina and Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe High Performance Plastic Parts for Semiconductor Equipment product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of High Performance Plastic Parts for Semiconductor Equipment, with revenue, gross margin and global market share of High Performance Plastic Parts for Semiconductor Equipment from 2018 to 2023.

Chapter 3, the High Performance Plastic Parts for Semiconductor Equipment competitive situation, revenue and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and application, with consumption value and growth rate by Type, application, from 2018 to 2029.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2018 to 2023.and High Performance Plastic Parts for Semiconductor Equipment market forecast, by regions, type and application, with consumption value, from 2024 to 2029.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War

Chapter 12, the key raw materials and key suppliers, and industry chain of High Performance Plastic Parts for Semiconductor Equipment.

Chapter 13, to describe High Performance Plastic Parts for Semiconductor Equipment research findings and conclusion.