Global Heat Sink for Consumer Electronics Supply, Demand and Key Producers, 2023-2029
The global Heat Sink for Consumer Electronics market size is expected to reach $ million by 2029, rising at a market growth of % CAGR during the forecast period (2023-2029).
The heat sink is a device that heats the easily heating electronic components in the electrical appliance. It is made of aluminum alloy, brass or bronze in plate shape, sheet shape, multiple sheet shape, etc. For example, the CPU in the computer needs to use a large heat sink, and the power supply pipe, line pipe, and power amplifier pipe in the TV need to use the heat sink. This report mainly studies the heat sink for consumer electronics.
This report studies the global Heat Sink for Consumer Electronics production, demand, key manufacturers, and key regions.
This report is a detailed and comprehensive analysis of the world market for Heat Sink for Consumer Electronics, and provides market size (US$ million) and Year-over-Year (YoY) Growth, considering 2022 as the base year. This report explores demand trends and competition, as well as details the characteristics of Heat Sink for Consumer Electronics that contribute to its increasing demand across many markets.
Highlights and key features of the study
Global Heat Sink for Consumer Electronics total production and demand, 2018-2029, (M Pcs)
Global Heat Sink for Consumer Electronics total production value, 2018-2029, (USD Million)
Global Heat Sink for Consumer Electronics production by region & country, production, value, CAGR, 2018-2029, (USD Million) & (M Pcs)
Global Heat Sink for Consumer Electronics consumption by region & country, CAGR, 2018-2029 & (M Pcs)
U.S. VS China: Heat Sink for Consumer Electronics domestic production, consumption, key domestic manufacturers and share
Global Heat Sink for Consumer Electronics production by manufacturer, production, price, value and market share 2018-2023, (USD Million) & (M Pcs)
Global Heat Sink for Consumer Electronics production by Type, production, value, CAGR, 2018-2029, (USD Million) & (M Pcs)
Global Heat Sink for Consumer Electronics production by Application production, value, CAGR, 2018-2029, (USD Million) & (M Pcs)
This reports profiles key players in the global Heat Sink for Consumer Electronics market based on the following parameters – company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Alpha, Molex, TE Connectivity, Delta, Mecc.Al, Ohmite, Aavid Thermalloy, Sunon and Advanced Thermal Solutions, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Stakeholders would have ease in decision-making through various strategy matrices used in analyzing the World Heat Sink for Consumer Electronics market
Detailed Segmentation:
Each section contains quantitative market data including market by value (US$ Millions), volume (production, consumption) & (M Pcs) and average price (US$/K Pcs) by manufacturer, by Type, and by Application. Data is given for the years 2018-2029 by year with 2022 as the base year, 2023 as the estimate year, and 2024-2029 as the forecast year.
Global Heat Sink for Consumer Electronics Market, By Region:
United States
China
Europe
Japan
South Korea
ASEAN
India
Rest of World
Global Heat Sink for Consumer Electronics Market, Segmentation by Type
Copper Material
Aluminum Alloy Material
Graphite or Graphene
Ceramic Material
Other
Global Heat Sink for Consumer Electronics Market, Segmentation by Application
Cell Phone
Computer
Television
Other
Companies Profiled:
Alpha
Molex
TE Connectivity
Delta
Mecc.Al
Ohmite
Aavid Thermalloy
Sunon
Advanced Thermal Solutions
DAU
Apex Microtechnology
Radian
Bergquist,Inc.
Laird Technologies,Inc
Panasonics
Fujipoly
Tanyuan Technology Co.,Ltd.
Shenzhen Frd Science&technology Co.,ltd.
Stoneplus Thermal Management Technologies Limited
Dongguan SuQun Industrial Co.,Ltd
Shenzhen Aochuan Technology Co., Ltd.
AVC(Asia Vital Components Co., Ltd)
AAC Technologies Holdings Inc.
AURAS Technology Co.,Ltd.
NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION
GuangDong Suqun New Material Co.,Ltd.
Suzhou Tianmai Thermal Technology Co., Ltd.
Jones Tech Plc
Suzhou Anjie Technology Co.,Ltd.
Shenzhen Everwin Precision Technology Co.,Ltd.
CUI
T-Global Technology
Wakefied-Vette
Key Questions Answered
1. How big is the global Heat Sink for Consumer Electronics market?
2. What is the demand of the global Heat Sink for Consumer Electronics market?
3. What is the year over year growth of the global Heat Sink for Consumer Electronics market?
4. What is the production and production value of the global Heat Sink for Consumer Electronics market?
5. Who are the key producers in the global Heat Sink for Consumer Electronics market?
6. What are the growth factors driving the market demand?
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