Global Heat Shrink Terminals and Splices Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Global Heat Shrink Terminals and Splices Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Heat shrink terminal is used for insulation, sealing and protection of joints from external abuse, scratches, moisture, salt and other hazardous elements. In order to shrink down the insulation after compressing the heat shrink connectors to electrical wire system, heat guns are used. Once, the heat shrink sleeve is heated and shrunk down onto the cable, it helps in increasing the mechanical strength of the terminal as well as resistance to corrosion.

According to our (Global Info Research) latest study, the global Heat Shrink Terminals and Splices market size was valued at US$ 351 million in 2023 and is forecast to a readjusted size of USD 485 million by 2030 with a CAGR of 4.8% during review period.

Molex, TE Connectivity, K.S. TERMINALS, 3M, ABB (T&B), Fuji Terminal, Panduit, FTZ Industries, NSPA (National Standard Parts Associates) are the key players in the global heat shrink terminals and splices market. This market is relatively dispersed, the Top 5 took up only 20.16% of the global market in 2019.

This report is a detailed and comprehensive analysis for global Heat Shrink Terminals and Splices market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Downstream Industry. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Heat Shrink Terminals and Splices market size and forecasts, in consumption value ($ Million), 2019-2030

Global Heat Shrink Terminals and Splices market size and forecasts by region and country, in consumption value ($ Million), 2019-2030

Global Heat Shrink Terminals and Splices market size and forecasts, by Type and by Downstream Industry, in consumption value ($ Million), 2019-2030

Global Heat Shrink Terminals and Splices market shares of main players, in revenue ($ Million), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Heat Shrink Terminals and Splices

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Heat Shrink Terminals and Splices market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Molex, TE Connectivity, 3M, Panduit, ABB (T&B), Fuji Terminal, Shawcor (DSG-Canusa), K.S. TERMINALS, Nichifu, Hubbell (Burndy), etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Heat Shrink Terminals and Splices market is split by Type and by Downstream Industry. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Downstream Industry. This analysis can help you expand your business by targeting qualified niche markets.

Market segmentation

Heat Shrink Terminals and Splices market is split by Type and by Downstream Industry. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Downstream Industry. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Heat Shrink Ring Terminals
Heat Shrink Fork Terminals
Heat Shrink Butt Splices
Heat Shrink Disconnect Terminals
Others

Market segment by Downstream Industry
Automotive Application
Marine Application
Industrial Application
Appliances
Others

Market segment by players, this report covers
Molex
TE Connectivity
3M
Panduit
ABB (T&B)
Fuji Terminal
Shawcor (DSG-Canusa)
K.S. TERMINALS
Nichifu
Hubbell (Burndy)
NSPA (National Standard Parts Associates)
Hillsdale Terminal
FTZ Industries
Jeesoon Terminals
UTA Auto Industrial
Yun Lin Electronic
Maikasen
EasyJoint Electric
AIRIC
Changhong Plastics Group Imperial Plastics

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Heat Shrink Terminals and Splices product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Heat Shrink Terminals and Splices, with revenue, gross margin, and global market share of Heat Shrink Terminals and Splices from 2019 to 2024.

Chapter 3, the Heat Shrink Terminals and Splices competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Downstream Industry, with consumption value and growth rate by Type, by Downstream Industry, from 2019 to 2030.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Heat Shrink Terminals and Splices market forecast, by regions, by Type and by Downstream Industry, with consumption value, from 2024 to 2030.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Heat Shrink Terminals and Splices.

Chapter 13, to describe Heat Shrink Terminals and Splices research findings and conclusion.