Global Through Glass Via (TGV) Wafer Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Global Through Glass Via (TGV) Wafer Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).

According to our (Global Info Research) latest study, the global Through Glass Via (TGV) Wafer market size was valued at US$ 79.1 million in 2023 and is forecast to a readjusted size of USD 661 million by 2030 with a CAGR of 35.8% during review period.

United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.

This report is a detailed and comprehensive analysis for global Through Glass Via (TGV) Wafer market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Through Glass Via (TGV) Wafer market size and forecasts, in consumption value ($ Million), 2019-2030

Global Through Glass Via (TGV) Wafer market size and forecasts by region and country, in consumption value ($ Million), 2019-2030

Global Through Glass Via (TGV) Wafer market size and forecasts, by Type and by Application, in consumption value ($ Million), 2019-2030

Global Through Glass Via (TGV) Wafer market shares of main players, in revenue ($ Million), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Through Glass Via (TGV) Wafer

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Through Glass Via (TGV) Wafer market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Through Glass Via (TGV) Wafer market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segmentation

Through Glass Via (TGV) Wafer market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
300 mm
200 mm
Below150 mm

Market segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others

Market segment by players, this report covers
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Through Glass Via (TGV) Wafer product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Through Glass Via (TGV) Wafer, with revenue, gross margin, and global market share of Through Glass Via (TGV) Wafer from 2019 to 2024.

Chapter 3, the Through Glass Via (TGV) Wafer competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Through Glass Via (TGV) Wafer market forecast, by regions, by Type and by Application, with consumption value, from 2024 to 2030.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Through Glass Via (TGV) Wafer.

Chapter 13, to describe Through Glass Via (TGV) Wafer research findings and conclusion.