Global Through Glass Via (TGV) Technology Market 2025 by Company, Regions, Type and Application, Forecast to 2031

Global Through Glass Via (TGV) Technology Market 2025 by Company, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Through Glass Via (TGV) Technology market size was valued at US$ 103 million in 2024 and is forecast to a readjusted size of USD 425 million by 2031 with a CAGR of 21.5% during review period.

Glass Through-Via (TGV, short for Through-Glass Via) is a miniaturization packaging technology used in semiconductor encapsulation and microelectronic devices. The TGV process enables the creation of precise through-holes (i.e., vias) in glass substrates, which are subsequently filled with conductive materials (such as metals) in subsequent processes. TGV features numerous through-holes in glass with diameters measured in micrometers, positioning it as a promising material for the next-generation semiconductor packaging substrates. High-quality TGV achieved through glass materials and hole processing technologies facilitates the miniaturization of devices in various markets, including data centers, 5G communication networks, and IoT devices, enabling high-density packaging and GHz-speed data processing.

Through-Glass Vias (TGV) represent an advanced three-dimensional integrated circuit technology, enabling device miniaturization across various sectors such as data centers, 5G communication networks, and IoT devices, in addition to facilitating high-density packaging and GHz-speed data processing. Glass emerges as a potential alternative to silicon interposers, with TGV offering advantages over Silicon Through-Vias (TSVs), including lower costs, ready availability of large-sized ultrathin glass substrates, and superior high-frequency electrical performance. Core to TGV technology lies in the deep hole formation process, with techniques like plasma etching and laser ablation having been developed for glass hole-making. Nonetheless, the fragility, smooth surface, and chemical inertness of glass materials currently hinder the mass production and widespread application of TGVs.

From a regional perspective, the Chinese market has witnessed rapid changes in recent years. In 2023, its market size stood at USD 17.86 million, constituting approximately 17.76% of the global total. By 2030, it is anticipated to reach USD 110.12 million, accounting for 25.97% of the global market. As the leading country in 5G network construction and a major producer of downstream 5G terminal equipment, China's TGV market growth surpasses the global average. Prospects for the TGV market are vast, poised for expansion with technological advancements and cost reductions.

The TGV substrate market landscape is highly concentrated, with foreign manufacturers dominating testing products and technologies. Key players include Corning, LPKF, Samtec, KISO WAVE Co., Ltd., and Tecnisco. Corning leads the global TGV substrate industry with a 24.67% market share in 2023, followed by LPKF at 22.37%, and Samtec at 9.67%. Chinese enterprises such as Xiamen Sky Semiconductor have made progress, with the former already supplying substantial quantities. However, this does not signify a clear path for Chinese companies in the TGV realm. Their future development remains to be tested by the market.

This report is a detailed and comprehensive analysis for global Through Glass Via (TGV) Technology market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Through Glass Via (TGV) Technology market size and forecasts, in consumption value ($ Million), 2020-2031

Global Through Glass Via (TGV) Technology market size and forecasts by region and country, in consumption value ($ Million), 2020-2031

Global Through Glass Via (TGV) Technology market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031

Global Through Glass Via (TGV) Technology market shares of main players, in revenue ($ Million), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Through Glass Via (TGV) Technology

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Through Glass Via (TGV) Technology market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Corning, LPKF, Samtec, KISO WAVE Co., Ltd., Xiamen Sky Semiconductor, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Through Glass Via (TGV) Technology market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
300 mm
200 mm
Less Than 150 mm

Market segment by Application
Consumer Electronics
Automobile Industry
Others

Market segment by players, this report covers
Corning
LPKF
Samtec
KISO WAVE Co., Ltd.
Xiamen Sky Semiconductor
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Through Glass Via (TGV) Technology product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Through Glass Via (TGV) Technology, with revenue, gross margin, and global market share of Through Glass Via (TGV) Technology from 2020 to 2025.

Chapter 3, the Through Glass Via (TGV) Technology competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Through Glass Via (TGV) Technology market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Through Glass Via (TGV) Technology.

Chapter 13, to describe Through Glass Via (TGV) Technology research findings and conclusion.