Global Glass Substrate for Semiconductor Packaging Market 2024 by Company, Regions, Type and Application, Forecast to 2030

Global Glass Substrate for Semiconductor Packaging Market 2024 by Company, Regions, Type and Application, Forecast to 2030

A glass substrate for semiconductor packaging refers to a specially designed glass material used as a base or platform for constructing and assembling electronic components, particularly semiconductors. It provides a stable and inert surface for mounting and connecting delicate semiconductor devices, such as integrated circuits (ICs), microprocessors, and memory chips. Glass substrates used in semiconductor packaging are engineered to possess specific characteristics that make them suitable for this application. These characteristics include high thermal conductivity, low coefficient of thermal expansion (CTE), electrical insulation properties, chemical resistance, and excellent dimensional stability. The glass substrate serves as a foundation for placing and interconnecting chips, allowing for the creation of complex electronic circuits. Additionally, it can provide protection against moisture, dust, and mechanical stress, enhancing the durability and reliability of the semiconductors. Compared to currently used organic substrates, glass substrates offer better thermal and mechanical stability and ultra-low flatness. These properties promote the increase in chip surface area and the number of chiplets on a single package. A dynamic that allows, in short, to improve the design rules necessary for artificial intelligence products and future data centers by an order of magnitude.

According to our (Global Info Research) latest study, the global Glass Substrate for Semiconductor Packaging market size was valued at US$ 185 million in 2023 and is forecast to a readjusted size of USD 518 million by 2030 with a CAGR of 15.4% during review period.

Global key players of Glass Substrate for Semiconductor Packaging include AGC, Schott, Corning, Hoya, Ohara, etc. The top five players hold a share about 90%. Asia-Pacific is the largest market, and has a share about 80%, followed by North America and Europe with share 16% and 3%, separately. In terms of product type, Coefficient of Thermal Expansion (CTE), above 5 ppm/°C is the largest segment, occupied for a share of 65%. In terms of application, Wafer Level Packaging has a share about 60 percent.

This report is a detailed and comprehensive analysis for global Glass Substrate for Semiconductor Packaging market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.

Key Features:

Global Glass Substrate for Semiconductor Packaging market size and forecasts, in consumption value ($ Million), 2019-2030

Global Glass Substrate for Semiconductor Packaging market size and forecasts by region and country, in consumption value ($ Million), 2019-2030

Global Glass Substrate for Semiconductor Packaging market size and forecasts, by Type and by Application, in consumption value ($ Million), 2019-2030

Global Glass Substrate for Semiconductor Packaging market shares of main players, in revenue ($ Million), 2019-2024

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Glass Substrate for Semiconductor Packaging

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Glass Substrate for Semiconductor Packaging market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include AGC, Schott, Corning, Hoya, Ohara, CrysTop Glass, WGTech, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Glass Substrate for Semiconductor Packaging market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segmentation

Glass Substrate for Semiconductor Packaging market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Coefficient of Thermal Expansion (CTE), above 5 ppm/°C
Coefficient of Thermal Expansion (CTE), below 5 ppm/°C

Market segment by Application
Wafer Level Packaging
Panel Level Packaging

Market segment by players, this report covers
AGC
Schott
Corning
Hoya
Ohara
CrysTop Glass
WGTech

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Glass Substrate for Semiconductor Packaging product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Glass Substrate for Semiconductor Packaging, with revenue, gross margin, and global market share of Glass Substrate for Semiconductor Packaging from 2019 to 2024.

Chapter 3, the Glass Substrate for Semiconductor Packaging competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Glass Substrate for Semiconductor Packaging market forecast, by regions, by Type and by Application, with consumption value, from 2024 to 2030.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Glass Substrate for Semiconductor Packaging.

Chapter 13, to describe Glass Substrate for Semiconductor Packaging research findings and conclusion.