Global Full-automatic Wafer Laser Marking Machine Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Full-automatic Wafer Laser Marking Machine market size was valued at US$ 197 million in 2024 and is forecast to a readjusted size of USD 290 million by 2031 with a CAGR of 5.8% during review period.

Laser marking machine is a device that uses high-energy laser beam to carve any desired text, graphics and images on the surface of an object. The effect of laser marking machine is to use high-energy density laser to partially irradiate the workpiece, so that the surface materials of various materials evaporate and expose the deep materials, thereby marking a permanent mark. This mark can be a beautiful pattern, trademark and text.

The wafer laser marking machine is generally understood as a marking machine acting on the wafer. Laser action on the wafer through the thermal light source instantaneous thermal ablation and vaporisation or through the cold light source to interrupt the material molecular bond, leaving the corresponding characters, text or patterns and other information on the wafer surface, wafer marking with automatic loading and unloading, automatic positioning, automatic marking function.Fully automatic wafer laser marking does not require human intervention and is equipped with automatic loading and unloading, which can greatly improve production efficiency and reduce manual intervention and production costs.

The market limitations and challenges faced by fully automatic wafer laser marking machines are mainly as follows:

1. The semiconductor industry, including the semiconductor equipment industry, is dependent on global supply chains. Political, geopolitical, economic and financial crises and instability have negatively impacted the semiconductor industry and its end markets in the past and may do so again in the future. Prolonged or increased use of trade barriers could result in slower global economic and semiconductor industry growth and could cause global market volatility, which could lead to lower end-customer electronic product sales and could reduce demand for semiconductor equipment products and services. Such developments could negatively impact the ability of semiconductor equipment suppliers to sell, ship products, collect payments and provide support to customers in certain regions in accordance with trade restrictions, embargoes, logistics restrictions and export control laws. Semiconductor equipment suppliers could also face shortages, increased costs and shipping delays for certain semiconductor components due to supply chain disruptions caused by geopolitical conflicts, such as recent hostilities affecting shipping in the Red Sea, which have resulted in increased shipping costs and delivery time delays, as well as related insurance costs, and the ongoing conflict between Russia and Ukraine.

2. Fierce market competition: In recent years, due to the sanctions imposed by the United States, great opportunities have been given to Chinese semiconductor equipment manufacturers. Chinese semiconductor equipment manufacturers need to continuously improve their own technical level and product quality, and accelerate the process of domestic substitution to meet the challenges from domestic and foreign competitors. In the future, Chinese semiconductor equipment manufacturers will face a more complex international environment. However, with the support of the government and the promotion of the market, these companies will continue to maintain a rapid development momentum. By increasing R&D investment, expanding market share, and strengthening industrial chain integration, they will continue to improve their competitiveness and influence. The competition among international companies in the Chinese market will become increasingly fierce.

This report is a detailed and comprehensive analysis for global Full-automatic Wafer Laser Marking Machine market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Full-automatic Wafer Laser Marking Machine market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Full-automatic Wafer Laser Marking Machine market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Full-automatic Wafer Laser Marking Machine market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (K US$/Unit), 2020-2031

Global Full-automatic Wafer Laser Marking Machine market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (K US$/Unit), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Full-automatic Wafer Laser Marking Machine

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Full-automatic Wafer Laser Marking Machine market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include EO Technics, Thinklaser (ESI), InnoLas Semiconductor GmbH, Han's Laser Corporation, FitTech, E&R Engineering Corp, HANMI Semiconductor, Towa Laserfront Corporation, Genesem, Hylax Technology, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

Full-automatic Wafer Laser Marking Machine market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Low Power Marking Machine
High Power Marking Machine

Market segment by Application
2-6 Inch Wafer
8 &12 Inch Wafer

Major players covered
EO Technics
Thinklaser (ESI)
InnoLas Semiconductor GmbH
Han's Laser Corporation
FitTech
E&R Engineering Corp
HANMI Semiconductor
Towa Laserfront Corporation
Genesem
Hylax Technology
Beijing KHL Technical Equipment
Shenzhen D-WIN Technology
Gem Laser Limited
New Power Team Technology
Nanjing Dinai Laser Technology
Tianhong Laser

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe Full-automatic Wafer Laser Marking Machine product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of Full-automatic Wafer Laser Marking Machine, with price, sales quantity, revenue, and global market share of Full-automatic Wafer Laser Marking Machine from 2020 to 2025.

Chapter 3, the Full-automatic Wafer Laser Marking Machine competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the Full-automatic Wafer Laser Marking Machine breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Full-automatic Wafer Laser Marking Machine market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of Full-automatic Wafer Laser Marking Machine.

Chapter 14 and 15, to describe Full-automatic Wafer Laser Marking Machine sales channel, distributors, customers, research findings and conclusion.