Global Fabless IC Design Market 2025 by Company, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global Fabless IC Design market size was valued at US$ 209540 million in 2024 and is forecast to a readjusted size of USD 553530 million by 2031 with a CAGR of 13.0% during review period.

Fabless IC design refers to fabless integrated circuit design. It is a business model in which companies focus on integrated circuit design and development without their own wafer manufacturing plants. Under this model, IC design companies usually only engage in the design and sales of semiconductors, while entrusting chip manufacturing, packaging and testing to chip foundry companies. Companies that adopt the Fabless model can focus on the design and sales of semiconductors. This allows these companies to not only concentrate resources to continue technological innovation and upgrading, but also to independently select advanced process technologies and enter into long-term strategic cooperation with top-ranked chip foundries, thereby making full use of the world's advanced process manufacturing technologies and mature quality management. system. In addition, under the Fabless model, the company will have high market sensitivity, quickly respond to market hot spots and demand changes, quickly launch new products, and focus on improving market development and customer maintenance capabilities. In terms of cost, the Fabless model has a relatively smaller initial capital investment compared to the IDM model. It can give full play to its R&D strength and market development capabilities and quickly achieve large-scale benefits. This report focuses on fabless IC design, including the Analog ICs, Logic ICs, Microcontroller and Microprocessor ICs and Memory ICs.

Global key players of Fabless IC Design include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, etc. The top five players hold a share about 71%. Asia-Pacific is the largest market, and has a share about 70%, followed by North America and Europe with share 20% and 8%, separately. In terms of product type, IC Design-Logic is the largest segment, accounting for a share of 57%. In terms of application, PCs is the largest field with a share about 29 percent.

This report is a detailed and comprehensive analysis for global Fabless IC Design market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global Fabless IC Design market size and forecasts, in consumption value ($ Million), 2020-2031

Global Fabless IC Design market size and forecasts by region and country, in consumption value ($ Million), 2020-2031

Global Fabless IC Design market size and forecasts, by Type and by Application, in consumption value ($ Million), 2020-2031

Global Fabless IC Design market shares of main players, in revenue ($ Million), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for Fabless IC Design

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global Fabless IC Design market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include NVIDIA, Qualcomm, Broadcom, Advanced Micro Devices, Inc. (AMD), MediaTek, Marvell Technology Group, Novatek Microelectronics Corp., Tsinghua Unigroup, Realtek Semiconductor Corporation, OmniVision Technology, Inc, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market segmentation

Fabless IC Design market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Analog ICs
Logic ICs
Microcontroller and Microprocessor ICs
Memory ICs

Market segment by Application
Mobile Devices
PCs
Automotive
Industrial & Medical
Servers
Network Infrastructure
Appliances/Consumer Goods
Others

Market segment by players, this report covers
NVIDIA
Qualcomm
Broadcom
Advanced Micro Devices, Inc. (AMD)
MediaTek
Marvell Technology Group
Novatek Microelectronics Corp.
Tsinghua Unigroup
Realtek Semiconductor Corporation
OmniVision Technology, Inc
Monolithic Power Systems, Inc. (MPS)
Cirrus Logic, Inc.
Socionext Inc.
LX Semicon
HiSilicon Technologies
Synaptics
Allegro MicroSystems
Himax Technologies
Semtech
Global Unichip Corporation (GUC)
Hygon Information Technology
GigaDevice
Silicon Motion
Ingenic Semiconductor
Raydium
Goodix Limited
Sitronix
Nordic Semiconductor
Silergy
Shanghai Fudan Microelectronics Group
Alchip Technologies
FocalTech
MegaChips Corporation
Elite Semiconductor Microelectronics Technology
SGMICRO

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)

The content of the study subjects, includes a total of 13 chapters:

Chapter 1, to describe Fabless IC Design product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top players of Fabless IC Design, with revenue, gross margin, and global market share of Fabless IC Design from 2020 to 2025.

Chapter 3, the Fabless IC Design competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.

Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2020 to 2031

Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2020 to 2025.and Fabless IC Design market forecast, by regions, by Type and by Application, with consumption value, from 2026 to 2031.

Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.

Chapter 12, the key raw materials and key suppliers, and industry chain of Fabless IC Design.

Chapter 13, to describe Fabless IC Design research findings and conclusion.