Global FPC Coverlay Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

According to our (Global Info Research) latest study, the global FPC Coverlay market size was valued at US$ 462 million in 2024 and is forecast to a readjusted size of USD 723 million by 2031 with a CAGR of 6.5% during review period.

FPC Coverlay consists of a solid sheet of polyimide with a layer of flexible adhesive. Coverlay plays the exact same function as a solder mask on rigid boards but only for flexible printed circuit boards (PCBs). Conventional solder masks have only a limited bendability, so for flex circuits that require greater bendability, coverlay is bonded (glued) on to encapsulate and protect the external copper circuit layers of a flexible printed circuit (FPC). Different from rigid PCB solder mask, coverlay is typically supplied in a roll form, sometimes in sheet and cut to size. From there, the coverlay openings needed may be drilled, routed, punched, or laser cut depending on the complexity of the flex PCB design and feature sizes. Once the pattern is created, the film is then aligned to the copper circuit layer and pressed under heat and pressure, over time, to cure the adhesive to complete the coverlay bonding.

At present, the FPC Coverlay market is in a booming stage. With the rapid development of consumer electronics, smart phones, wearable devices, automotive electronics and other fields, the demand for flexible circuit boards (FPC) is increasing, and FPC Coverlay, as a key component of FPC, is also increasing in market demand.

Globally, the Asia-Pacific region, especially China, Japan and South Korea, is the main consumer area of ​​the FPC Coverlay market. As the world's largest consumer electronics production base, China has huge market demand, especially in the fields of smart phones, tablets, wearable devices, etc. These products have a high demand for flexible circuit boards, which directly promotes the growth of the FPC Coverlay market. At the same time, the demand for high-end electronic products in the European and American markets also provides solid support for the FPC Coverlay market.

From the perspective of technical application, with the rapid development of emerging technologies such as 5G communications, the Internet of Things, and artificial intelligence, the complexity of electronic products continues to increase, especially FPC products that require higher density and high reliability. The high performance requirements of FPC Coverlay are also increasing. Modern FPC Coverlay is not only required to have good insulation performance, heat resistance, and chemical stability, but also needs to have outstanding performance in terms of wear resistance, moisture resistance, and corrosion resistance, which puts higher demands on the research and development of Coverlay materials.

Global FPC coverlay manufacturers include DuPont, Taiflex, Arisawa Mfg and INNOX Advanced Materials. The top four companies hold a share about 38%. The global origins are mainly located in North America, Europe, China, Japan, South Korea and Taiwan (China). In terms of type, black coverlay is the largest segment, with a share of about 43%. And in terms of application, the double sided (SS) FPC segment holds a share of about 81 percent.

This report is a detailed and comprehensive analysis for global FPC Coverlay market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.

Key Features:

Global FPC Coverlay market size and forecasts, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/K Sqm), 2020-2031

Global FPC Coverlay market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/K Sqm), 2020-2031

Global FPC Coverlay market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Sqm), and average selling prices (US$/K Sqm), 2020-2031

Global FPC Coverlay market shares of main players, shipments in revenue ($ Million), sales quantity (K Sqm), and ASP (US$/K Sqm), 2020-2025

The Primary Objectives in This Report Are:

To determine the size of the total market opportunity of global and key countries

To assess the growth potential for FPC Coverlay

To forecast future growth in each product and end-use market

To assess competitive factors affecting the marketplace

This report profiles key players in the global FPC Coverlay market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Taiflex, Arisawa Mfg, INNOX Advanced Materials, ITEQ Corporation, Nikkan, SYTECH, AEM, Zhengye Technology, Hanwha Advanced Materials, etc.

This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.

Market Segmentation

FPC Coverlay market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.

Market segment by Type
Yellow Coverlay
Black Coverlay
Others

Market segment by Application
Single Sided (SS) FPC
Double Sided (DS) FPC

Major players covered
DuPont
Taiflex
Arisawa Mfg
INNOX Advanced Materials
ITEQ Corporation
Nikkan
SYTECH
AEM
Zhengye Technology
Hanwha Advanced Materials
Microcosm
Hongzheng Technology
Dongyi
Advance Materials Corporation

Market segment by region, regional analysis covers

North America (United States, Canada, and Mexico)

Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)

Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)

South America (Brazil, Argentina, Colombia, and Rest of South America)

Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe FPC Coverlay product scope, market overview, market estimation caveats and base year.

Chapter 2, to profile the top manufacturers of FPC Coverlay, with price, sales quantity, revenue, and global market share of FPC Coverlay from 2020 to 2025.

Chapter 3, the FPC Coverlay competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the FPC Coverlay breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.

Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and FPC Coverlay market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.

Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.

Chapter 13, the key raw materials and key suppliers, and industry chain of FPC Coverlay.

Chapter 14 and 15, to describe FPC Coverlay sales channel, distributors, customers, research findings and conclusion.